H10P 72/33
Into and out of processing chamber
Official title: {into and out of processing chamber}
H10P72/33 (Into and out of processing chamber) appears on 4,373 US grants and 5,459 published applications in this corpus.
Search patents in H10P- Granted patents
- 4,373
- Published applications
- 5,459
- Assignees
- 957
- Inventors
- 8,715
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 6 | 0 |
| 1985 | 6 | 0 |
| 1986 | 16 | 0 |
| 1987 | 19 | 0 |
| 1988 | 17 | 0 |
| 1989 | 20 | 0 |
| 1990 | 22 | 0 |
| 1991 | 17 | 0 |
| 1992 | 20 | 0 |
| 1993 | 31 | 0 |
| 1994 | 31 | 0 |
| 1995 | 30 | 0 |
| 1996 | 30 | 0 |
| 1997 | 34 | 0 |
| 1998 | 43 | 0 |
| 1999 | 68 | 0 |
| 2000 | 83 | 0 |
| 2001 | 105 | 76 |
| 2002 | 103 | 105 |
| 2003 | 94 | 127 |
| 2004 | 80 | 107 |
| 2005 | 72 | 121 |
| 2006 | 65 | 145 |
| 2007 | 57 | 166 |
| 2008 | 56 | 207 |
| 2009 | 46 | 163 |
| 2010 | 98 | 193 |
| 2011 | 127 | 195 |
| 2012 | 128 | 218 |
| 2013 | 144 | 195 |
| 2014 | 156 | 197 |
| 2015 | 179 | 201 |
| 2016 | 184 | 194 |
| 2017 | 138 | 189 |
| 2018 | 157 | 238 |
| 2019 | 214 | 273 |
| 2020 | 201 | 346 |
| 2021 | 217 | 297 |
| 2022 | 256 | 393 |
| 2023 | 236 | 356 |
| 2024 | 278 | 274 |
| 2025 | 287 | 294 |
| 2026 | 183 | 189 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 72/3302Mechanical parts of transfer devices1,917
- H10P 72/3306Horizontal transfer of a single workpiece1,153
- H10P 72/3304Characterised by movements or sequence of movements of transfer devices892
- H10P 72/3314Continuous loading and unloading into and out of a processing chamber478
- H10P 72/3312Vertical transfer of a batch of workpieces440
- H10P 72/3311Horizontal transfer of a batch of workpieces414
- H10P 72/3308Vertical transfer of a single workpiece359
Recent patents
- Substrate treating apparatus and substrate treating method6 Oct 2026US 12,757,672 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method29 Sep 2026US 12,751,246 B2Tokyo Electron Limited
- Wafer alignment assembly of the solder reflow system29 Sep 2026US 12,751,247 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Modularized bonding apparatus22 Sep 2026US 12,745,584 B2Hanwha Precision Machinery Co., Ltd.
- Substrate processing method and substrate processing apparatus22 Sep 2026US 12,745,586 B2Ebara Corporation
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Wafer transfer blade and assembly8 Oct 2026US 2026/0314311 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314316 A1SCREEN Holdings Co., Ltd.
- Apparatus for processing substrate and method of transferring substrate8 Oct 2026US 2026/0314331 A1Tokyo Electron Limited
Most cited
By later US patents
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993