H10P 72/3304
Characterised by movements or sequence of movements of transfer devices
Official title: {characterised by movements or sequence of movements of transfer devices}
H10P72/3304 (Characterised by movements or sequence of movements of transfer devices) appears on 892 US grants and 1,082 published applications in this corpus.
Search patents in H10P- Granted patents
- 892
- Published applications
- 1,082
- Assignees
- 247
- Inventors
- 1,982
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 4 | 0 |
| 1997 | 8 | 0 |
| 1998 | 5 | 0 |
| 1999 | 23 | 0 |
| 2000 | 31 | 0 |
| 2001 | 35 | 17 |
| 2002 | 26 | 33 |
| 2003 | 26 | 34 |
| 2004 | 24 | 32 |
| 2005 | 26 | 28 |
| 2006 | 17 | 47 |
| 2007 | 21 | 41 |
| 2008 | 17 | 77 |
| 2009 | 12 | 39 |
| 2010 | 26 | 32 |
| 2011 | 33 | 41 |
| 2012 | 27 | 36 |
| 2013 | 37 | 29 |
| 2014 | 24 | 28 |
| 2015 | 37 | 32 |
| 2016 | 24 | 30 |
| 2017 | 23 | 41 |
| 2018 | 33 | 38 |
| 2019 | 40 | 44 |
| 2020 | 35 | 71 |
| 2021 | 58 | 50 |
| 2022 | 40 | 61 |
| 2023 | 43 | 60 |
| 2024 | 38 | 50 |
| 2025 | 43 | 56 |
| 2026 | 25 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate treating apparatus and substrate treating method6 Oct 2026US 12,757,672 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method29 Sep 2026US 12,751,246 B2Tokyo Electron Limited
- Wafer alignment assembly of the solder reflow system29 Sep 2026US 12,751,247 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Method and/or system for processing a substrate and robot apparatus therefor1 Sep 2026US 12,722,310 B2Service Support Specialties, Inc.
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293584 A1SCREEN Holdings Co., Ltd.
- Systems and methods for tray cassette warehousing24 Sep 2026US 2026/0293595 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate Processing Apparatus and Method of Operating Substrate Processing Apparatus17 Sep 2026US 2026/0282820 A1Tokyo Electron Limited
- High throughput polishing modules and modular polishing systems27 Aug 2026US 2026/0255918 A1APPLIED Materials.Inc.
- Photovoltaic stress-free interconnection device, use method and assembly20 Aug 2026US 2026/0247747 A1Zhejiang Znergy Solar Co., Ltd.
Most cited
By later US patents
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Method and apparatus for scheduling wafer processing within a multiple chamber semiconductor wafer processing tool having a multiple blade robot619US 6,074,443 AAPPLIED Materials.Inc. · 2000
- Multiple chamber integrated process system612US 5,882,165 AAPPLIED Materials.Inc. · 1999
- Perimeter partition-valve with protected seals and associated small size process chambers and multiple chamber systems529US 7,682,454 B2Sundew Technologies, LLC · 2010
- Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus527US 7,690,881 B2ASM Japan K .K. · 2010