Method and/or system for processing a substrate and robot apparatus therefor

A semiconductor processing system comprising:

• a first stack of process modules and a third stack of process modules, the first stack of process modules being spaced apart from the third stack of process modules by a first portion of an aisle;
• a first robot apparatus at least partially located within the first portion of the aisle, the first robot apparatus comprising:
• a first arm having a first end effector at a first end thereof and a second end effector at a second end thereof;
• and
• a second arm having a first end effector at a first end thereof and a second end effector at a second end thereof, the second arm being spaced vertically from the first arm;
• wherein the first robot apparatus is configured to:
• maneuver the first arm so that the first end effector of the first arm interacts with one of the process modules of the first stack or the second end effector of the first arm interacts with one of the process modules of the third stack;
• and
• maneuver the second arm so that the first end effector of the second arm interacts with one of the process modules of the first stack or the second end effector of the second arm interacts with one of the process modules of the third stack;
• and
• wherein the first robot apparatus is devoid of any rotational axis, such that the first and second arms are incapable of rotation and are configured to move only along linear axes.