Wafer alignment assembly of the solder reflow system

A solder reflow system comprising:

• a solder reflow oven configured to perform a reflow process;
• a buffer station configured to accommodate wafer assemblies after the reflow process;
• and
• a wafer alignment assembly located between the solder reflow oven and the buffer station and comprising:
• a first tapered wall extending in a first horizontal direction;
• a first spring wall attached to an inner surface of the first tapered wall;
• a first set of conveyor rollers configured to rotate;
• a second tapered wall extending in the first horizontal direction, wherein the first tapered wall and the second tapered wall comprise respective hypotenuses at a proximate end of the wafer alignment assembly, each hypotenuse widens a distance between the first tapered wall and the second tapered wall toward the proximate end;
• a second spring wall attached to an inner surface of the first tapered wall;
• and
• a second set of conveyor rollers configured to rotate.

A wafer alignment assembly comprising:

• a first tapered wall extending in a first horizontal direction;
• a first spring wall attached to an inner surface of the first tapered wall;
• a second tapered wall extending in the first horizontal direction;
• a second spring wall attached to an inner surface of the first tapered wall;
• and
• a set of conveyor rollers configured to rotate;
• wherein at least one conveyor roller of the set of conveyor rollers comprises a roller cap comprising a raised portion extending along a surface of the at least one conveyor roller and extending radially beyond the surface of the at least one conveyor roller, the roller cap configured to lift a wafer assembly as the at least one conveyor roller rotates, thereby momentarily releasing friction between the wafer assembly and the set of conveyor rollers.