H10P 72/3308
Vertical transfer of a single workpiece
Official title: {Vertical transfer of a single workpiece}
H10P72/3308 (Vertical transfer of a single workpiece) appears on 359 US grants and 379 published applications in this corpus.
Search patents in H10P- Granted patents
- 359
- Published applications
- 379
- Assignees
- 166
- Inventors
- 899
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 10 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 7 | 0 |
| 1995 | 2 | 0 |
| 1996 | 7 | 0 |
| 1997 | 1 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 10 | 9 |
| 2002 | 7 | 10 |
| 2003 | 13 | 19 |
| 2004 | 6 | 16 |
| 2005 | 14 | 21 |
| 2006 | 9 | 15 |
| 2007 | 11 | 26 |
| 2008 | 8 | 11 |
| 2009 | 6 | 14 |
| 2010 | 6 | 17 |
| 2011 | 11 | 7 |
| 2012 | 9 | 13 |
| 2013 | 9 | 8 |
| 2014 | 10 | 13 |
| 2015 | 11 | 16 |
| 2016 | 9 | 14 |
| 2017 | 11 | 6 |
| 2018 | 11 | 13 |
| 2019 | 8 | 20 |
| 2020 | 13 | 19 |
| 2021 | 8 | 12 |
| 2022 | 10 | 29 |
| 2023 | 20 | 17 |
| 2024 | 16 | 17 |
| 2025 | 21 | 6 |
| 2026 | 4 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium23 Jun 2026US 12,666,906 B2Kokusai Electric Corporation
- Buffer chamber, substrate treating apparatus and substrate treating method9 Jun 2026US 12,649,164 B2Semes Co., Ltd.
- Apparatus and method of treating substrate26 May 2026US 12,642,036 B2Semes Co., Ltd.
- Load-bearing device, wafer transfer device, chamber device and wafer processing apparatus19 May 2026US 12,635,461 B2Zhongke Jingyuan Electron Limited, Beijing (CN)
- Substrate processing apparatus and substrate processing method30 Dec 2025US 12,512,354 B2Tokyo Electron Limited
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314316 A1SCREEN Holdings Co., Ltd.
- Batch substrate processing for area selective deposition1 Oct 2026US 2026/0305230 A1ASM IP Holding B. V.
- Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording medium24 Sep 2026US 2026/0293590 A1Kokusai Electric Corporation
- Reaction chamber and wafer etching device16 Jul 2026US 2026/0206534 A1Beijing E-Town Semiconductor Technology Co., Ltd.
- Transfer head and semiconductor manufacturing apparatus including the same16 Jul 2026US 2026/0206535 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Processing system and method for treating a substrate558US 7,651,583 B2Tokyo Electron Limited · 2010
- Method and device for transferring wafers525US 6,481,945 B1ASM International N.V. · 2002
- Plasma enhanced atomic layer deposition system having reduced contamination451US 7,422,636 B2Tokyo Electron Limited · 2008
- Wafer processing apparatus and method430US 6,455,098 B2Semix Incorporated · 2002