Apparatus and method of treating substrate

An apparatus for treating a substrate, the apparatus comprising:

• a first process processing unit configured to process the substrate in a batch manner;
• and
• a second process processing unit configured to process the substrate in a single-wafer type,
• wherein the first process processing unit includes
• a posture change processing tank having an accommodation space in which a liquid is accommodated,
• a support member configured to support at least one substrate in the accommodation space in a vertical posture, and
• a posture changing robot configured to change a posture of the substrate in a state of being immersed in the liquid from the vertical posture to a horizontal posture, wherein the posture changing robot includes a hand and an arm that moves the hand.

An apparatus for treating a substrate, the apparatus comprising:

• a first process processing unit configured to process the substrate in a batch manner;
• a second process processing unit configured to process the substrate in a single-wafer type;
• and
• a controller, wherein
• the first process processing unit includes
• a batch processing tank configured to process substrates in a vertical posture,
• a posture change processing tank configured to change a posture of the substrate in the vertical posture to a horizontal posture, wherein the posture change processing tank has an accommodation space in which a liquid is accommodated, and a support member configured to support the substrate in the vertical posture is in the accommodation space, and
• a posture changing robot configured to change the posture of the substrate in a state of being immersed in the liquid from the vertical posture to the horizontal posture, the posture changing robot including a hand and an arm for moving the hand,
• the second process processing unit includes
• a buffer unit configured to provide a space for temporarily storing the substrate,
• a single-wafer type liquid processing chamber configured to liquid-process the substrate by supplying a processing liquid to the substrate in rotation,
• a single-wafer type drying chamber configured to dry the substrate by supplying a supercritical fluid to the substrate, and
• a transfer robot configured to transfer the substrate between the buffer unit and the single-wafer type liquid processing chamber, or between the buffer unit and the single-wafer type drying chamber, and
• the controller is configured to control the posture changing robot so that the substrate moves in a horizontal direction while rotating about one axis in the state of being immersed in the liquid accommodated in the accommodation space when the posture of the substrate is changed, and control the posture changing robot so that the posture changing robot completes a change of the posture of the substrate and then transfers the substrate to the buffer unit.