Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

A method of manufacturing a semiconductor device, comprising:

• loading a substrate onto a substrate mounting table provided in a substrate holder by a substrate transferrer;
• transferring the substrate holder holding the substrate into a process container;
• and
• supplying a film-forming gas to the substrate in the process container,
• wherein, in the supply of the film-forming gas to the substrate, between a start of supplying the film-forming gas to the substrate and a formation of a film of a desired thickness on the substrate, the supply of the film-forming gas is interrupted at least once before a critical thickness of the film is formed at which the substrate cannot be separated off from the substrate mounting part by a substrate transfer mechanism, and the substrate is cooled to a predetermined temperature, the substrate placed on the substrate mounting part is lifted by the substrate transfer mechanism, and a separation process is performed in which the substrate is lowered to an original position on the substrate mounting part without transporting the substrate.

A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising:

• loading a substrate onto a substrate mounting table provided in a substrate holder by a substrate transferrer;
• transferring the substrate holder holding the substrate into a process container;
• and
• supplying a film-forming gas to the substrate in the process container,
• wherein, in the supply of the film-forming gas to the substrate, between a start of supplying the film-forming gas to the substrate and a formation of a film of a desired thickness on the substrate, the supply of the film-forming gas is interrupted at least once before a critical thickness of the film is formed at which the substrate cannot be separated off from the substrate mounting part by a substrate transfer mechanism, and the substrate is cooled to a predetermined temperature, the substrate placed on the substrate mounting part is lifted by the substrate transfer mechanism, and then a separation process is performed in which the substrate is lowered to an original position on the substrate mounting part without transporting the substrate.