Reaction chamber and wafer etching device
AssigneeBeijing E-Town Semiconductor Technology Co., Ltd.
InventorsChangle GUAN, Xinyun ZHANG, Qiang FAN
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Abstract
Provided is a reaction chamber and a wafer etching device. The reaction chamber includes: a chamber body internally provided with a wafer stage; a wafer transfer port in communication with an interior of the chamber body; a first liner slidably connected to the inner wall of the chamber body and slidably sleeved on the outer wall of the wafer stage; a first support part disposed between the chamber body and the wafer stage, and located outside the first liner; a first jacking mechanism provided in the first support.
Claims20
A reaction chamber applied to a wafer etching device, comprising:
- a chamber body internally provided with a wafer stage;
- a wafer transfer port in communication with an interior of the chamber body and configured to transfer a wafer to the wafer stage;
- a first liner slidably connected to an inner wall of the chamber body, and slidably sleeved on an outer wall of the wafer stage, wherein the first liner is disposed coaxially with the wafer stage;
- wherein the first liner is configured to control an on/off state of the wafer transfer port;
- a first support part disposed between the chamber body and the wafer stage and located outside the first liner;
- and
- a first jacking mechanism provided in the first support part wherein a lifting part of the first jacking mechanism is connected to the first liner, and configured to drive the first liner to slide.
The reaction chamber according to claim 9, wherein the first tubular body is a vacuum bellows made of a corrosion resistant stainless steel material.
The reaction chamber according to claim 14, wherein when the valve core is in a fourth working position, the valve plate contacts the bottom plate to close the pumping port.
The reaction chamber according to claim 16, wherein a plurality of first heaters are provided and arranged along a vertical direction, and each of the plurality of first heaters is electrically connected to the first controller configured to control the plurality of first heaters to heat different regions of the first liner at respective temperatures.
A wafer etching device comprising:
- a reaction chamber comprising:
- a chamber body internally provided with a wafer stage;
- a wafer transfer port in communication with an interior of the chamber body and configured to transfer a wafer to the wafer stage;
- a first liner slidably connected to an inner wall of the chamber body, and slidably sleeved on an outer wall of the wafer stage, wherein the first liner is disposed coaxially with the wafer stage;
- wherein the first liner is configured to control an on/off state of the wafer transfer port;
- a first support part disposed between the chamber body and the wafer stage and located outside the first liner;
- and
- a first jacking mechanism provided in the first support part, wherein a lifting part of the first jacking mechanism is connected to the first liner, and configured to drive the first liner to slide.
Dependencies are inferred from the claim text.