Transfer head and semiconductor manufacturing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsGYUNAM KIM, DAEHYUN KIM, YOUNGAN SONG, SUNGYONG LEE, YUNHWAN HWANG
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AssigneeSamsung Electronics Co., Ltd.
InventorsGYUNAM KIM, DAEHYUN KIM, YOUNGAN SONG, SUNGYONG LEE, YUNHWAN HWANG
Estimating the term…
A transfer head includes a horizontal body extending in a first direction, vertical arms connected to opposite peripheral portions of the horizontal body, respectively, the vertical arms extending in parallel to each other in a second direction perpendicular to the first direction, and each of the vertical arms having a side surface facing inward, and graspers connected to lower ends of the vertical arms, respectively, and the graspers configured to hold a substrate. Each of the vertical arms has a thickness in a third direction perpendicular to the first and second directions, and, for each vertical arm of the vertical arms, the thickness in the third direction decreases in a direction extending from an inner surface of the vertical arm to an outer surface of the vertical arm.
A transfer head comprising:
A transfer head comprising:
A semiconductor manufacturing apparatus comprising:
Dependencies are inferred from the claim text.