Modularized bonding apparatus
AssigneeHanwha Precision Machinery Co., Ltd.
InventorsTae Woo Kang, Ho Joon Shin
Life of this patent
Estimating the term…
Abstract
Provided is a bonding apparatus including a first wafer supplier including a plurality of load ports configured to store wafers having different sizes, the wafers including a plurality of substrate wafers and a plurality of die supply wafers, a first transferer adjacent to the first wafer supplier and configured to transfer the wafers, a first bonding device and a second bonding device facing the first wafer supplier, and configured to receive the wafers from the first wafer supplier and perform bonding, and a first cleaner comprising a plurality of cleaning areas, each of which is configured to receive the plurality of substrate wafers and the plurality of die supply wafers by the first transferer, and clean the plurality of substrate wafers and the plurality of die supply wafers.
Claims18
A bonding apparatus comprising:
- a first wafer supplier comprising a plurality of load ports configured to store wafers having different sizes, the wafers comprising a plurality of substrate wafers and a plurality of die supply wafers;
- a first transferer adjacent to the first wafer supplier and configured to transfer the wafers;
- a first bonding device and a second bonding device facing the first wafer supplier, and configured to receive the wafers from the first wafer supplier and perform bonding;
- and
- a first cleaner comprising a plurality of cleaning areas, each of which is configured to receive the plurality of substrate wafers and the plurality of die supply wafers by the first transferer, and clean the plurality of substrate wafers and the plurality of die supply wafers,
- wherein each of the first bonding device and the second bonding device comprises:
- a bonder configured to bond dies from the plurality of die supply wafers to the plurality of substrate wafers, respectively;
- and
- a pre-annealing oven configured to pre-anneal the plurality of bonded substrate wafers,
- wherein, in each of the first bonding device and the second bonding device, the pre-annealing oven is arranged to be spaced apart from the bonder, and
- wherein the first transferer is configured to transfer the plurality of pre-annealed substrate wafers to an annealing chamber for secondary annealing.
A bonding apparatus comprising:
- a first wafer supplier including a plurality of load ports configured to store wafers having different sizes, the wafers comprising a plurality of substrate wafers and a plurality of die supply wafers;
- a first transferer adjacent to the first wafer supplier and configured to transfer the wafers;
- a first bonding device and a second bonding device facing the first wafer supplier, and configured to receive the wafers from the first wafer supplier and perform bonding;
- a first cleaner comprising a plurality of cleaning areas, each of which is configured to receive the plurality of substrate wafers and the plurality of die supply wafers by the first transferer, and clean the plurality of substrate wafers and the plurality of die supply wafers;
- and
- a second wafer supplier facing the first cleaner and comprising a plurality of load ports configured to store the plurality of substrate wafers and the plurality of die supply wafers having different sizes, and
- wherein each of the first bonding device and the second bonding device comprises:
- a bonder configured to bond dies from the plurality of die supply wafers to the plurality of substrate wafers, respectively;
- and
- a pre-annealing oven configured to pre-anneal the plurality of bonded substrate wafers,
- wherein, in each of the first bonding device and the second bonding device, the pre-annealing oven is arranged to be spaced apart from the bonder, and
- wherein the first transferer is configured to transfer the plurality of pre-annealed substrate wafers to an annealing chamber for secondary annealing.
Dependencies are inferred from the claim text.