H10P 72/3302
Mechanical parts of transfer devices
Official title: {Mechanical parts of transfer devices}
H10P72/3302 (Mechanical parts of transfer devices) appears on 1,917 US grants and 2,541 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,917
- Published applications
- 2,541
- Assignees
- 419
- Inventors
- 3,947
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 10 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 11 | 0 |
| 1999 | 25 | 0 |
| 2000 | 32 | 0 |
| 2001 | 27 | 16 |
| 2002 | 27 | 43 |
| 2003 | 24 | 31 |
| 2004 | 35 | 28 |
| 2005 | 23 | 53 |
| 2006 | 17 | 63 |
| 2007 | 22 | 58 |
| 2008 | 20 | 103 |
| 2009 | 20 | 64 |
| 2010 | 44 | 81 |
| 2011 | 49 | 74 |
| 2012 | 53 | 77 |
| 2013 | 70 | 81 |
| 2014 | 74 | 85 |
| 2015 | 79 | 93 |
| 2016 | 81 | 78 |
| 2017 | 52 | 100 |
| 2018 | 82 | 110 |
| 2019 | 109 | 114 |
| 2020 | 103 | 182 |
| 2021 | 115 | 147 |
| 2022 | 129 | 205 |
| 2023 | 118 | 207 |
| 2024 | 143 | 161 |
| 2025 | 166 | 172 |
| 2026 | 98 | 115 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate treating apparatus and substrate treating method6 Oct 2026US 12,757,672 B2Semes Co., Ltd.
- Wafer alignment assembly of the solder reflow system29 Sep 2026US 12,751,247 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Modularized bonding apparatus22 Sep 2026US 12,745,584 B2Hanwha Precision Machinery Co., Ltd.
- Substrate processing method and substrate processing apparatus22 Sep 2026US 12,745,586 B2Ebara Corporation
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Yokes, yoke assemblies and semiconductor processing systems including yokes, and related methods of making yokes and forming semiconductor structures using yokes1 Oct 2026US 2026/0305241 A1ASM IP Holding B. V.
- Electrostatic end effector for manufacturing system robot1 Oct 2026US 2026/0305253 A1APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method24 Sep 2026US 2026/0293584 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010
- Multi-chamber integrated process system988US 4,951,601 AAPPLIED Materials.Inc. · 1990
- Ultra high throughput wafer vacuum processing system973US 5,855,681 AAPPLIED Materials.Inc. · 1999
- Staged-vacuum wafer processing system and method701US 5,186,718 AAPPLIED Materials.Inc. · 1993
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001