H10P 72/3311
Horizontal transfer of a batch of workpieces
Official title: {Horizontal transfer of a batch of workpieces}
H10P72/3311 (Horizontal transfer of a batch of workpieces) appears on 414 US grants and 479 published applications in this corpus.
Search patents in H10P- Granted patents
- 414
- Published applications
- 479
- Assignees
- 185
- Inventors
- 1,001
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 4 |
| 2002 | 9 | 12 |
| 2003 | 10 | 15 |
| 2004 | 12 | 7 |
| 2005 | 6 | 16 |
| 2006 | 4 | 20 |
| 2007 | 6 | 4 |
| 2008 | 7 | 14 |
| 2009 | 1 | 20 |
| 2010 | 8 | 13 |
| 2011 | 6 | 20 |
| 2012 | 17 | 18 |
| 2013 | 8 | 21 |
| 2014 | 14 | 16 |
| 2015 | 9 | 14 |
| 2016 | 12 | 13 |
| 2017 | 10 | 13 |
| 2018 | 13 | 19 |
| 2019 | 22 | 29 |
| 2020 | 25 | 42 |
| 2021 | 22 | 31 |
| 2022 | 30 | 36 |
| 2023 | 26 | 31 |
| 2024 | 27 | 16 |
| 2025 | 23 | 20 |
| 2026 | 12 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium25 Aug 2026US 12,720,650 B2Kokusai Electric Corporation
- Substrate transfer method and semiconductor manufacturing system2 Jun 2026US 12,648,400 B2Tokyo Electron Limited
- Device and method for processing at least one semiconductor substrate28 Apr 2026US 12,615,989 B2Robert Bosch GmbH
- Substrate receiving area for process chambers14 Apr 2026US 12,601,060 B2CemeCon AG
- Adaptive settling window for wafer handling robot17 Sep 2026US 2026/0282826 A1ASM IP Holding B. V.
- Substrate processing apparatus and substrate processing method6 Aug 2026US 2026/0231727 A1
- Bottom purge for semiconductor processing system30 Jul 2026US 2026/0223622 A1APPLIED Materials.Inc.
- Substrate processing system and teaching method23 Jul 2026US 2026/0215217 A1Tokyo Electron Limited
- Methods and apparatus for thermal processing of materials4 Jun 2026US 2026/0151793 A1PulseForge Inc.
Most cited
By later US patents
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Semiconductor wafer processing apparatus having improved wafer input/output handling system485US 6,447,232 B1Semitool, Inc. · 2002
- Vacuum transfer module and substrate processing apparatus343US 10,763,139 B2Tokyo Electron Limited · 2020
- Multideck wafer processing system243US 6,176,667 B1APPLIED Materials.Inc. · 2001
- Process and apparatus for treating wafers with process fluids185US 4,778,532 ACFM Technologies Limited Partnership · 1988