Vacuum transfer module and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorTakehiro Shindo
Life of this patent
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Abstract
A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing substrate in a vacuum atmosphere are connected, has therein a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules. The vacuum transfer module includes: a housing in which a vacuum atmosphere is generated; and a plurality of adaptor attaching portions to which one of a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules is attached, provided at a sidewall of the housing. The adaptor attaching portions are common for the first adaptor and the second adaptor.
Claims15
A vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing a substrate in a vacuum atmosphere are connected, the vacuum transfer module comprising:
- a housing in which a vacuum atmosphere is generated;
- a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules,
- a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules;
- and
- a plurality of adaptor attaching portions, to which one of the first adaptor and the second adaptor is attached, provided at a sidewall of the housing, the plurality of adaptor attaching portions being common for the first adaptor and the second adaptor,
- wherein the first and the second adaptors include plate-shaped members and through-holes defining transfer ports are formed in each of the plate-shaped members, and
- wherein an arrangement of the through-holes within the plate-shaped member of the first adaptor and an arrangement of the through-holes within the plate-shaped member of the second adaptor are different from each other.
A substrate processing apparatus comprising:
- a vacuum transfer module, to which a load-lock module and a plurality of processing modules for processing a substrate in a vacuum atmosphere are connected, the vacuum transfer module comprising:
- a housing in which a vacuum atmosphere is generated;
- a substrate transfer unit for transferring the substrate between the load-lock module and the plurality of processing modules;
- a first adaptor for connecting the load-lock module and a second adaptor for connecting the plurality of processing modules;
- and
- a plurality of adaptor attaching portions, to which one of the first adaptor and the second adaptor is attached, provided at a sidewall of the housing, the plurality of adaptor attaching portions being common for the first adaptor and the second adaptor,
- wherein the first and the second adaptors include plate-shaped members and through-holes defining transfer ports are formed in each of the plate-shaped members, and
- wherein an arrangement of the through-holes within the plate-shaped member of the first adaptor and an arrangement of the through-holes within the plate-shaped member of the second adaptor are different from each other,
- the load-lock module;
- the plurality of processing modules;
- and
- a loader module, to which a transfer container where the substrate is stored is mounted, configured to transfer the substrate between the transfer container and the load-lock module.
Dependencies are inferred from the claim text.