Substrate transfer method and semiconductor manufacturing system

A semiconductor manufacturing system for transferring a plurality of substrates, the semiconductor manufacturing system comprising:

• a plurality of transfer modules provided with a transfer robot configured to transfer the plurality of substrates;
• a pass module arranged between the plurality of transfer modules;
• one or more process modules connected to the plurality of transfer modules, the one or more process modules being configured to perform substrate processing on the plurality of substrates transferred by a corresponding transfer module of the plurality of transfer modules;
• and
• a control device configured to transfer the substrate from one of the plurality of transfer modules to the process module connected to another one of the plurality of transfer modules via the pass module by controlling the transfer robot, wherein
• when the plurality of substrates are carried into the pass module, the control device makes a determination as to whether to perform one-by-one correction in which the plurality of substrates are placed on a plurality of stages of the pass module upon correcting positions of the plurality of substrates on a one-by-one basis or to perform average correction in which the plurality of substrates are placed on the plurality of stages collectively upon taking an average value of the positions of the plurality of substrates.