Adaptive settling window for wafer handling robot

A substrate processing system, comprising:

• a wafer transfer robot with an end effector,
• an automatic wafer centering sensor array,
• a processing chamber with a substrate support, and
• a controller configured to:
• control the wafer transfer robot to transfer a wafer during a place operation through a field of view of the automatic wafer centering sensor array using a current settling window;
• calculate a first wafer position on the end effector during the place operation using the automatic wafer centering sensor array;
• control the wafer transfer robot to transfer a wafer during a pick operation through the field of view of the automatic wafer centering sensor array using the current settling window;
• calculate a second wafer position on the end effector during the pick operation using the automatic wafer centering sensor array;
• calculate a position difference between the first wafer position and the second wafer position;
• and
• adjust the current settling window based on the position difference.

A method, comprising:

• receiving a wafer settling window for a substrate processing system;
• performing cyclic operations of picking and placing wafers carried by an end effector of a wafer transfer robot within the substrate processing system using the wafer settling window;
• and
• determining accuracy of two or more of the cyclic operations using an automatic wafer centering sensor arranged along a movement path of the end effector.