H10P 72/3306
Horizontal transfer of a single workpiece
Official title: {Horizontal transfer of a single workpiece}
H10P72/3306 (Horizontal transfer of a single workpiece) appears on 1,153 US grants and 1,367 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,153
- Published applications
- 1,367
- Assignees
- 317
- Inventors
- 2,682
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 1 | 0 |
| 1986 | 11 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 11 | 0 |
| 1990 | 13 | 0 |
| 1991 | 8 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 7 | 0 |
| 1995 | 3 | 0 |
| 1996 | 11 | 0 |
| 1997 | 7 | 0 |
| 1998 | 13 | 0 |
| 1999 | 20 | 0 |
| 2000 | 24 | 0 |
| 2001 | 30 | 32 |
| 2002 | 38 | 23 |
| 2003 | 22 | 33 |
| 2004 | 19 | 36 |
| 2005 | 23 | 37 |
| 2006 | 21 | 45 |
| 2007 | 16 | 57 |
| 2008 | 20 | 57 |
| 2009 | 13 | 42 |
| 2010 | 34 | 61 |
| 2011 | 36 | 50 |
| 2012 | 45 | 44 |
| 2013 | 38 | 32 |
| 2014 | 34 | 29 |
| 2015 | 27 | 45 |
| 2016 | 40 | 39 |
| 2017 | 26 | 34 |
| 2018 | 29 | 41 |
| 2019 | 43 | 88 |
| 2020 | 39 | 78 |
| 2021 | 52 | 76 |
| 2022 | 70 | 106 |
| 2023 | 69 | 105 |
| 2024 | 89 | 65 |
| 2025 | 67 | 69 |
| 2026 | 47 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Substrate processing system and substrate transfer method8 Sep 2026US 12,733,437 B2Tokyo Electron Limited
- Substrate transfer method8 Sep 2026US 12,733,441 B2Tokyo Electron Limited
- Method and/or system for processing a substrate and robot apparatus therefor1 Sep 2026US 12,722,310 B2Service Support Specialties, Inc.
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium25 Aug 2026US 12,720,650 B2Kokusai Electric Corporation
- Wafer transfer blade and assembly8 Oct 2026US 2026/0314311 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314316 A1SCREEN Holdings Co., Ltd.
- Apparatus for processing substrate and method of transferring substrate8 Oct 2026US 2026/0314331 A1Tokyo Electron Limited
- Substrate processing apparatus24 Sep 2026US 2026/0293596 A1SCREEN Holdings Co., Ltd.
- Handling panel substrates17 Sep 2026US 2026/0282813 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Compartnetalized substrate processing chamber732US 5,730,801 AAPPLIED Materials.Inc. · 1998
- Modular processing apparatus for processing semiconductor wafers635US 4,722,298 AMachine Technology, Inc. · 1988
- Multiple chamber integrated process system612US 5,882,165 AAPPLIED Materials.Inc. · 1999
- Semiconductor processing system with gas curtain612US 5,997,588 AAdvanced Semiconductor Materials America, Inc. · 1999
- High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock573US 6,048,154 AAPPLIED Materials.Inc. · 2000