High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock
AssigneeApplied Materials, Inc.
InventorJoe Wytman
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorJoe Wytman
Estimating the term…
A dual stage load lock is provided for transfer of semiconductor wafers between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber and a second load lock chamber separated by a dividing ledge which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations. A method for transferring wafers through the load lock is also provided.
A load lock apparatus for transferring an article between a first environment at substantial atmospheric pressure and a high vacuum processing system comprising:
A method for transferring an article between an ambient atmospheric pressure environment and a processing vacuum environment, through a load lock chamber having loading and transfer chambers that are separated by a ledge having an opening for passing the article there between, the ledge having a first side that faces the loading chamber and a second side that faces the transfer chamber, comprising:
A method for transferring an article between a first ambient atmospheric pressure environment and a processing vacuum environment, through a load lock chamber having selectively separable first and second chambers, comprising:
Dependencies are inferred from the claim text.