H10P 72/3314
Continuous loading and unloading into and out of a processing chamber
Official title: {Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers}
H10P72/3314 (Continuous loading and unloading into and out of a processing chamber) appears on 478 US grants and 673 published applications in this corpus.
Search patents in H10P- Granted patents
- 478
- Published applications
- 673
- Assignees
- 290
- Inventors
- 1,520
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 2 | 0 |
| 2001 | 10 | 5 |
| 2002 | 12 | 2 |
| 2003 | 11 | 18 |
| 2004 | 5 | 3 |
| 2005 | 1 | 5 |
| 2006 | 2 | 3 |
| 2007 | 4 | 9 |
| 2008 | 2 | 15 |
| 2009 | 3 | 18 |
| 2010 | 4 | 28 |
| 2011 | 14 | 37 |
| 2012 | 12 | 58 |
| 2013 | 16 | 33 |
| 2014 | 23 | 48 |
| 2015 | 40 | 40 |
| 2016 | 42 | 49 |
| 2017 | 25 | 28 |
| 2018 | 23 | 33 |
| 2019 | 29 | 38 |
| 2020 | 19 | 39 |
| 2021 | 20 | 35 |
| 2022 | 32 | 35 |
| 2023 | 20 | 31 |
| 2024 | 28 | 24 |
| 2025 | 29 | 24 |
| 2026 | 19 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Liquid-carrying roller for wet etching and wet etching method2 Jun 2026US 12,648,254 B2Ja Solar Technology Yangzhou Co., Ltd.
- Coating chamber with distance detection for the substrates26 May 2026US 12,637,758 B2Singulus Technologies AG
- Integrated semiconductor die vessel processing workstations12 May 2026US 12,628,610 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate transfer apparatus and substrate transfer method12 May 2026US 12,628,611 B2Tokyo Electron Limited
- Dispensing apparatus5 May 2026US 12,617,003 B2Illinois Tool Works Inc.
- Processing apparatus and chip manufacturing method27 Aug 2026US 2026/0250874 A1Disco Corporation
- High throughput polishing modules and modular polishing systems27 Aug 2026US 2026/0255918 A1APPLIED Materials.Inc.
- Inspection device20 Aug 2026US 2026/0243701 A1Saki Corporation
- Controlled Environment Photoresist Processing System and Method20 Aug 2026US 2026/0244113 A1
- Method and system for applying a fluid discharged from a slot-die head to one or more advancing substrates20 Aug 2026US 2026/0247906 A1FOM Technologies A/S
Most cited
By later US patents
- Methods for atomic layer etching526US 8,633,115 B2APPLIED Materials.Inc. · 2014
- Apparatus and method for high throughput sputtering366US 5,683,561 AConner Peripherals, Inc. · 1997
- Method of clamping a substrate and clamp preparation unit using capillary clamping force288US 9,460,954 B2Mapper Lithography IP B.V. · 2016
- Substrate transfer shuttle having a magnetic drive131US 6,206,176 B1Applied Komatsu Technology, Inc. · 2001
- Installation for the storage and transfer of objects in a very clean atmosphere89US 4,851,018 ACommissariat A L' Energie Atomique · 1989