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US 12,628,610 B2Granted
Integrated semiconductor die vessel processing workstations
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Sheng Kuo, Guan-Wei Huang, Chih-Hung Huang, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
Life of this patent
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Abstract
In certain embodiments, a workstation includes: a cleaning station configured to clean a die vessel, wherein the die vessel is configured to secure a semiconductor die; an inspection station configured to inspect the die vessel after cleaning to determine whether the die vessel is identified as passing inspection; and a conveyor configured to move the die vessel between the cleaning station and the inspection station.
Claims20
A method, comprising:
- receiving a die vessel at a disassembly station;
- determining whether the die vessel comprises a first type of die vessel or a second type of die vessel;
- and
- disassembling multiple parts of the die vessel when the die vessel is determined to be the first type of die vessel,
- wherein the determining comprises measuring a weight of the die vessel using a weight sensor located at the disassembly station, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the weight sensor.
2 more elements
A method, comprising:
- securing a semiconductor die in a die vessel;
- receiving the die vessel at a disassembly station;
- determining whether the die vessel comprises a first type of die vessel or a second type of die vessel;
- disassembling multiple parts of the die vessel when the die vessel is determined to be the first type of die vessel;
- and
- moving the one or more parts of the die vessel between the disassembly station and a pass output port or a fail output port based on whether the one or more parts of the die vessel is identified as passing an inspection when the die vessel comprises either the first type of die vessel or the second type of die vessel,
- wherein the determining comprises measuring a weight of the die vessel using a weight sensor located at the disassembly station, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the weight sensor.
4 more elements
A method, comprising:
- receiving a die vessel at a disassembly station configured to receive a die vessel;
- determining whether the die vessel comprises a first type of die vessel or a second type of die vessel, wherein the determining comprises measuring a weight of the die vessel using a weight sensor located at the disassembly station, and wherein the disassembly station determines whether the die vessel comprises the first or second type of die vessel based on an output of the weight sensor;
- disassembling multiple parts of the die vessel when the die vessel comprises the first type of die vessel;
- cleaning one or more parts of the die vessel;
- inspecting the one or more parts of the die vessel after cleaning to determine whether the die vessel is identified as passing inspection;
- and
- moving the one or more parts of the die vessel between the disassembly station, the cleaning station and the inspection station.
4 more elements
Dependencies are inferred from the claim text.