Apparatus and method for high throughput sputtering

A high throughput, in-line sputtering apparatus for applying a magnetic coating to the surface of a plurality of disk substrates, the substrates being provided in a substrate carrier, said apparatus comprising:

• means for sputtering a multi-layer coating onto the plurality of substrates, said means for sputtering including a series of sputtering chambers, and at least one buffer chamber disposed between ones of said series of sputtering chambers, isolated from ambient atmospheric conditions;
• means for transporting said plurality of substrates through said means for sputtering, the means for transporting coupled to the substrate carrier such that the substrate carrier is suspended from a top portion of the substrate carrier and transported through the apparatus at at least a first velocity and a second, different velocity;
• means for evacuating said means for sputtering to a vacuum level within a pressure range sufficient to enable sputtering operation;
• means for heating said plurality of substrates to a temperature conducive to sputtering said multi-layer coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrate;
• and
• control means for providing control signals to, and for receiving feedback input from, said means for sputtering, means for transporting, means for evacuating, and means for heating, said control means being programmable to automatically control said means for sputtering, means for transporting, means for evacuating and means for heating to synchronize said means for sputtering, means for transporting, and means for heating, the control means providing the feedback input to a user interface and being responsive to input from the user interface;
• wherein the control means alters the control signals in real time responsive to the input from the user interface.

An in-line, high throughput sputtering apparatus applying magnetic coatings to a plurality of disk substrates in a pallet, the pallet having a planar shape, a top and a bottom, comprising:

• control means for providing control signals and for monitoring a plurality of sensory input signals;
• an entrance lock chamber and an exit lock chamber;
• a plurality of sequential sputtering chambers positioned between the entrance lock chamber and the exit lock chamber;
• a transport system responsive to a first subset of said control signals and supporting the pallets at the top of the pallet, the entrance lock, and the exit lock, the transport system carrying said pallet at a first velocity of a minimum of about 2.5 ft/min through each of said plurality of sputtering chambers, and carrying said pallet at a second, different velocity in one of said sputtering chambers, the transport system including a first set of means for providing said sensory input signals to said control means;
• means for evacuating the apparatus to a reduced pressure level within a pressure range to enable sputtering operation responsive to said control means, said means for reducing including a second set of means for providing said sensory input signals to said control means;
• means for heating said plurality of substrates to an ambient temperature, said temperature having a substantially uniform profile over the surface of each said substrate and said pallet, said means for heating including a third set of means for providing said sensory input signals to said control means;
• and
• means for sputtering a multi-layer coating onto said substrate responsive to said control means, said means for sputtering including a third set of means for providing said sensory input signals to said control means.

An in-line sputtering apparatus for applying magnetic coatings to disk substrates, comprising:

• an input chamber;
• an output chamber;
• a plurality of sputter and buffer chambers wherein at least one buffer chamber is disposed between a first and second ones of the plurality of sputter chambers;
• a transport system including
• a plurality of pallets, each having a planar shape, a top portion and a bottom portion, and each supporting a plurality of the disk substrates,
• means for suspending each of the pallets from the top portion of each pallet, and for moving the pallet through the apparatus through the input, output, sputter and buffer chambers, and
• means for moving the means for suspending, from the input end to the output end, in continuous motion through the sputter and buffer chambers, at a first velocity and a second, different velocity;
• a pumping system for evacuating the input, output, sputter and buffer chambers;
• and
• a control system coupled to the pumping system, input, output, sputter and buffer chambers, and transport system.

An in-line sputtering apparatus for applying magnetic coatings to disk substrates, comprising:

• an input chamber;
• an output chamber;
• a plurality of sputter and buffer chambers wherein at least one buffer chamber is disposed between a first and second ones of the plurality of sputter chambers;
• a transport system including
• a plurality of pallets, each having a planar shape, a top portion and a bottom portion, and each supporting a plurality of the disk substrates,
• an overhead carrier coupling each of the pallets from the top portion of each pallet, and transporting each pallet through the apparatus through the input, output, sputter and buffer chambers, and
• a plurality of motors for moving the overhead carrier at a first velocity and a second, different velocity through the sputter and buffer chambers;
• a pumping system for evacuating the input, output, sputter and buffer chambers;
• and
• a control system coupled to the pumping system, input, output, sputter and buffer chambers, and transport system.