H10P 72/3312
Vertical transfer of a batch of workpieces
Official title: {Vertical transfer of a batch of workpieces}
H10P72/3312 (Vertical transfer of a batch of workpieces) appears on 440 US grants and 546 published applications in this corpus.
Search patents in H10P- Granted patents
- 440
- Published applications
- 546
- Assignees
- 164
- Inventors
- 1,107
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 9 | 0 |
| 1997 | 9 | 0 |
| 1998 | 8 | 0 |
| 1999 | 8 | 0 |
| 2000 | 11 | 0 |
| 2001 | 13 | 7 |
| 2002 | 12 | 13 |
| 2003 | 11 | 8 |
| 2004 | 6 | 9 |
| 2005 | 2 | 14 |
| 2006 | 3 | 11 |
| 2007 | 4 | 16 |
| 2008 | 5 | 17 |
| 2009 | 2 | 13 |
| 2010 | 14 | 12 |
| 2011 | 10 | 11 |
| 2012 | 8 | 32 |
| 2013 | 12 | 21 |
| 2014 | 8 | 20 |
| 2015 | 13 | 20 |
| 2016 | 13 | 13 |
| 2017 | 16 | 19 |
| 2018 | 16 | 25 |
| 2019 | 13 | 19 |
| 2020 | 20 | 36 |
| 2021 | 16 | 36 |
| 2022 | 31 | 44 |
| 2023 | 19 | 38 |
| 2024 | 30 | 28 |
| 2025 | 35 | 42 |
| 2026 | 24 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Substrate processing method and substrate processing apparatus4 Aug 2026US 12,701,951 B2Canon Kabushiki Kaisha
- Substrate processing module and substrate processing device provided with same14 Jul 2026US 12,678,833 B2Daikin Finetech, Ltd.
- Substrate processing system2 Jun 2026US 12,648,401 B2SCREEN Holdings Co., Ltd.
- Wafer processing device, system and control method applied to wafer processing device2 Jun 2026US 12,648,402 B2Swaysure Technology Co., Ltd.
- Integrated substrate processing apparatus and method20 Aug 2026US 2026/0242952 A1Picosun Oy
- Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, recording medium, and transfer machine13 Aug 2026US 2026/0234793 A1Kokusai Electric Corporation
- Bottom purge for semiconductor processing system30 Jul 2026US 2026/0223622 A1APPLIED Materials.Inc.
- Method and device for filling microstructured trench of semiconductor with neutron conversion material9 Jul 2026US 2026/0198237 A1Nuclear Power Institute of China
- Substrate treatment device and substrate treatment method2 Jul 2026US 2026/0190921 A1SCREEN Holdings Co., Ltd.
Most cited
By later US patents
- High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock573US 6,048,154 AAPPLIED Materials.Inc. · 2000
- Method and device for transferring wafers525US 6,481,945 B1ASM International N.V. · 2002
- Device for treating micro-circuit wafers515US 5,407,449 AASM International N.V. · 1995
- Vertical plasma enhanced process apparatus and method489US 6,321,680 B2Torrex Equipment Corporation · 2001
- Wafer handling system486US 6,981,832 B2ASM International N.V. · 2006