Substrate processing method and substrate processing apparatus
AssigneeCanon Kabushiki Kaisha
InventorShinichi Shudo
Life of this patent
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Abstract
A processing method for a substrate processing apparatus including a chamber in which a heating plate configured to heat a substrate placed on the heating plate is located including heating the heating plate to a first temperature, cooling the heating plate to a second temperature from the first temperature, supplying dry gas into the chamber during the heating and the cooling, and carrying in the substrate onto the heating plate after the cooling.
Claims13
A processing method for a substrate processing apparatus including a chamber in which a heating plate configured to heat a substrate to be placed on the heating plate is located, the processing method comprising:
- heating the heating plate to a first temperature;
- cooling the heating plate to a second temperature from the first temperature, the first temperature is higher than the second temperature;
- supplying dry gas into the chamber continuously during both the heating and the cooling, the supplying of the dry gas is started before the heating plate reaches a third temperature at which outgas is generated from the heating plate;
- and
- carrying in the substrate onto the heating plate after the cooling.
Dependencies are inferred from the claim text.