Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, recording medium, and transfer machine
AssigneeKokusai Electric Corporation
InventorsTakeshi KASAI, Akinori ISHII, Toshiki FUJINO
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Abstract
A technique capable of reducing particles adhering to a substrate is provided includes a process chamber that processes a substrate in a state of being held by a substrate holder; a transfer chamber which is adjacent to the process chamber and in which the substrate holder can be arranged; and an injector that is arranged in the transfer chamber, is configured to be movable along a longitudinal direction of a column of the substrate holder in the transfer chamber, and injects gas toward the column.
Claims17
A substrate processing apparatus comprising:
- a process chamber that processes a substrate in a state of being held by a substrate holder;
- a transfer chamber which is adjacent to the process chamber and in which the substrate holder is able to be arranged;
- an injector that is arranged in the transfer chamber, is configured to be movable along a longitudinal direction of a column of the substrate holder in the transfer chamber, and injects gas toward the column;
- and
- a rotation mechanism that rotatably supports the substrate holder about a central axis corresponding to a center of the substrate,
- wherein an injection hole of the injector injects the gas for cleaning toward the column from a tangential direction of a circle centered on the central axis and passing through the column.
A substrate processing method comprising:
- (a) processing a substrate in a state being held by a substrate holder in a process chamber;
- (b) loading and unloading a substrate together with the substrate holder between the process chamber and a transfer chamber arranged adjacent to the process chamber;
- and
- (c) injecting, by an injector arranged in the transfer chamber and configured to be movable along a longitudinal direction of a column of the substrate holder in the transfer chamber, gas toward the column.
A transfer machine comprising:
- a substrate gripper that loads and unloads the substrate into and from a substrate holder that holds the substrate when the substrate is processed in a process chamber;
- and
- an injector configured to be movable along a longitudinal direction of a column of the substrate holder and inject gas toward the column,
- wherein the injector has an injection hole that is concentric with a center of the substrate held by the substrate holder and is configured to be able to inject the gas for cleaning toward the column from a tangential direction of an edge passing through the column.
Dependencies are inferred from the claim text.