US 6,981,832 B2 · Wafer handling system

Abstract

A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.

Claims21

Dependent claims

A wafer processing system configured for handling standard 300-mm FOUP cassettes, the system comprising:

an input/output station;
a cassette transfer region adjacent to the input/output station;
a wafer handling chamber adjacent to the cassette transfer region, the wafer handling chamber senarated from the cassette transfer region by an interface configured for interacting with a 300-mm FOUP cassette;
a cassette transfer mechanism configured for transferring cassettes from the input/output station through the cassette transfer region to the interface;
a wafer handling robot within the wafer handling chamber, the wafer handling robot configured to access wafers within cassettes through the interface;
and
a tool set adapted for receiving and transferring 200-mm open cassettes within the wafer processing system, wherein the cassette transfer mechanism comprises a cassette handler robot configured to transfer cassettes between the input/output station and the cassette transfer region, wherein the cassette handler robot has a bearing surface designed to receive a standard 300-mm FOUP cassette, the wafer processing system further comprising a cassette handler adapter configured to fit on the bearing surface, the cassette handler adapter further configured to accommodate a 200-mm open cassette thereon.

4 more elements

A wafer processing system configured for handling standard 300-mm FOUP cassettes, the system comprising:

an input/output station;
a cassette transfer region adjacent to the input/output station;
a wafer handling chamber adjacent to the cassette transfer region, the wafer handling chamber separated from the cassette transfer region by an interface configured for interacting with a 300-mm FOUP cassette;
a cassette transfer mechanism configured for transferring cassettes from the input/output station through the cassette transfer region to the interface;
a wafer handling robot within the wafer handling chamber, the wafer handling robot configured to access wafers within cassettes through the interface;
and
a tool set adapted for receiving and transferring 200-mm open cassettes within the wafer processing system, wherein the cassette transfer mechanism comprises a cassette handler robot configured to transfer cassettes between the input/output station and the cassette transfer region, wherein the tool set comprises a Transhipment FOUP cassette having external surfaces conforming to a 300-mm FOUP cassette standard, the Transhipment FOUP cassette comprising an internal platform configured to receive a 200-mm open cassette, further comprising a sensor arrangement to determine presence of a 200-mm cassette at discrete positions within the wafer processing system, the sensor arrangement capable of distinguishing presence of a 300-mm FOUP cassette from presence of a 200-mm open cassette at the discrete locations, wherein the sensor arrangement includes a plurality of light sensors, light emitters, reflectors and a central processing unit, wherein the cassette handler robot includes an end effector with a bearing surface configured to receive a standard 300-mm FOUP cassette, the wafer processing system further comprising a cassette handler adapter configured to fit on the bearing surface of the cassette handler robot, the cassette handler adapter further configured to accommodate a 200-mm open cassette thereon, wherein the sensor arrangement comprises at least one light sensor and one light emitter arranged to detect the cassette handler adapter when mounted upon the bearing surface of the cassette handler robot.

4 more elements

Dependencies are inferred from the claim text.

Wafer handling system

Life of this patent

Wafer handling system

Life of this patent

Abstract

Claims21