A wafer processing device, comprising:
- a machining region, comprising at least one machining assembly;
- a wafer loading and unloading region, comprising a wafer loading and unloading chamber and a wafer transfer assembly provided within the wafer loading and unloading chamber, wherein the wafer transfer assembly is configured to make a to-be-processed wafer within a wafer cassette to be transferred to a wafer boat or to make a processed wafer on the wafer boat to be transferred to the wafer cassette;
- a wafer boat loading and unloading region, comprising a wafer boat loading and unloading chamber and a wafer boat base provided within the wafer boat loading and unloading chamber, wherein the wafer boat base is configured to carry the wafer boat and to send the wafer boat into or out of the at least one machining assembly;
- an isolation region, located between the wafer boat loading and unloading region and the wafer loading and unloading region, and comprising a plurality of mutually independent isolation chambers, wherein a front switching door is provided between each of the plurality of isolation chambers and the wafer boat loading and unloading chamber, the front switching door is capable of being opened or closed for opening or closing each of the plurality of isolation chambers and the wafer boat loading and unloading chamber, wherein a rear switching door is provided between each of the plurality of isolation chambers and the wafer boat loading and unloading chamber, and is capable of being opened or closed for opening or closing each of the plurality of isolation chambers and the wafer boat loading and unloading chamber;
- and
- at least two wafer boats and a transfer device, wherein the transfer device is configured to transfer the at least two wafer boats between the wafer loading and unloading chamber and an interior of each of the plurality of isolation chambers and the transfer device is further configured to transfer the at least two wafer boats between the wafer boat loading and unloading chamber and each of the plurality of isolation chambers;
- wherein the plurality of isolation chambers comprise a first isolation chamber and a second isolation chamber, and the first isolation chamber is configured to accommodate a wafer boat that is transferred from the wafer loading and unloading chamber to an interior of the first isolation chamber and is loaded with the to-be-processed wafer, and the second isolation chamber is configured to accommodate the wafer boat that is transferred from the wafer boat loading and unloading chamber to an interior of the second isolation chamber and is loaded with the processed wafer.