Method and device for filling microstructured trench of semiconductor with neutron conversion material

A device for filling a microstructured trench of a semiconductor with a neutron conversion material, comprising:

• a semiconductor loader (1), wherein a surface of the semiconductor loader (1) is provided with a loading groove (11), a surface of the loading groove (11) contains an electrostatic self-adhesive film (2), and an edge of the semiconductor loader (1) is provided with a limiting notch (12);
• and
• a support frame (4) that supports the semiconductor loader (1), wherein the support frame (4) comprises a bottom tray (42) and a stand column (41) vertically arranged on an edge of the bottom tray (42), and a width of the stand column (41) matches a size of the limiting notch of the semiconductor loader (1).