Integrated substrate processing apparatus and method
AssigneePicosun Oy
InventorsFabien PIALLAT, Safdar MUHAMMAD, Soumen MAZUMDER, Varun SHARMA, Michel EL KHOURY MAROUN, Ryan LEY
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Abstract
An integrated substrate processing apparatus (100) comprises substrate modules integrated, under vacuum, via a wafer handling module (150). The substrate modules comprise a first substrate processing module (110) provided with a remote plasma generator (115), configured to process one substrate (101) at a time in a plasma-enhanced process, and a second substrate processing module (120) capable of processing a batch of substrates (101) in a thermal mode for thin film deposition.
Claims28
An integrated substrate processing apparatus, comprising substrate modules integrated, under vacuum, via a wafer handling module wherein the substrate modules comprise:
- a first substrate processing module provided with a remote plasma generator, configured to process one substrate at a time in a plasma-enhanced process, and
- a second substrate processing module capable of processing a batch of substrates in a thermal mode for thin film deposition.
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A method for processing substrates in an integrated substrate processing apparatus, comprising substrate modules integrated, under vacuum, via a wafer handling module the method comprising:
- processing one substrate at a time in a plasma-enhanced process in a first substrate processing module provided with a remote plasma generator, and
- processing a batch of substrates in a thermal mode for thin film deposition in a second substrate processing module.
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Dependencies are inferred from the claim text.