H10P 72/34
The wafers being stored in a carrier, involving loading and unloading
Official title: {the wafers being stored in a carrier, involving loading and unloading}
H10P72/34 (The wafers being stored in a carrier, involving loading and unloading) appears on 3,376 US grants and 3,606 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,376
- Published applications
- 3,606
- Assignees
- 766
- Inventors
- 5,973
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 11 | 0 |
| 1986 | 12 | 0 |
| 1987 | 22 | 0 |
| 1988 | 25 | 0 |
| 1989 | 29 | 0 |
| 1990 | 32 | 0 |
| 1991 | 22 | 0 |
| 1992 | 22 | 0 |
| 1993 | 29 | 0 |
| 1994 | 33 | 0 |
| 1995 | 42 | 0 |
| 1996 | 33 | 0 |
| 1997 | 52 | 0 |
| 1998 | 70 | 0 |
| 1999 | 67 | 0 |
| 2000 | 96 | 0 |
| 2001 | 83 | 51 |
| 2002 | 100 | 122 |
| 2003 | 103 | 125 |
| 2004 | 95 | 127 |
| 2005 | 64 | 93 |
| 2006 | 57 | 92 |
| 2007 | 51 | 116 |
| 2008 | 45 | 125 |
| 2009 | 41 | 115 |
| 2010 | 73 | 107 |
| 2011 | 65 | 82 |
| 2012 | 63 | 96 |
| 2013 | 70 | 107 |
| 2014 | 92 | 117 |
| 2015 | 113 | 142 |
| 2016 | 113 | 121 |
| 2017 | 104 | 124 |
| 2018 | 129 | 176 |
| 2019 | 170 | 182 |
| 2020 | 160 | 225 |
| 2021 | 173 | 191 |
| 2022 | 161 | 207 |
| 2023 | 170 | 228 |
| 2024 | 169 | 201 |
| 2025 | 165 | 194 |
| 2026 | 122 | 140 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Transferring unit, article transferring system, and control method of transferring unit29 Sep 2026US 12,747,107 B2Semes Co., Ltd.
- Prevention of contamination of substrates during gas purging29 Sep 2026US 12,751,244 B2APPLIED Materials.Inc.
- Substrate processing apparatus and substrate processing method29 Sep 2026US 12,751,246 B2Tokyo Electron Limited
- Optically activated object mass transfer using multiple optical energy sources29 Sep 2026US 12,751,252 B2Genesee Valley Innovations, LLC
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Semiconductor Thermal Processing Apparatus and Method for Transferring Workpieces by Carrier Device Thereof8 Oct 2026US 2026/0314307 A1Beijing Naura Microelectronics Equipment Co., Ltd.
- Operation method and device for cleaning foup8 Oct 2026US 2026/0314317 A1Asia Neo Tech Industrial Co., Ltd.
- Storage system1 Oct 2026US 2026/0296783 A1Murata Machinery, Ltd.
- Substrate holder, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium1 Oct 2026US 2026/0305236 A1Kokusai Electric Corporation
Most cited
By later US patents
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Modular wafer transport and processing system655US 4,917,556 AVarian Associates, Inc. · 1990
- Method and apparatus for batch processing a semiconductor wafer605US 5,167,716 AGaSonics, Inc. · 1992
- Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers604US 5,388,945 AInternational Business Machines Corporation · 1995
- Wafer probing test machine597US 5,278,494 ATokyo Electron Yamanashi Limited · 1994