H10P 72/3406
Involving removal of lid, door or cover
Official title: {involving removal of lid, door or cover}
H10P72/3406 (Involving removal of lid, door or cover) appears on 706 US grants and 742 published applications in this corpus.
Search patents in H10P- Granted patents
- 706
- Published applications
- 742
- Assignees
- 199
- Inventors
- 1,276
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 18 | 0 |
| 1998 | 16 | 0 |
| 1999 | 10 | 0 |
| 2000 | 21 | 0 |
| 2001 | 21 | 16 |
| 2002 | 33 | 31 |
| 2003 | 29 | 40 |
| 2004 | 31 | 37 |
| 2005 | 15 | 21 |
| 2006 | 17 | 26 |
| 2007 | 12 | 28 |
| 2008 | 15 | 34 |
| 2009 | 10 | 31 |
| 2010 | 16 | 28 |
| 2011 | 11 | 10 |
| 2012 | 16 | 13 |
| 2013 | 17 | 17 |
| 2014 | 17 | 26 |
| 2015 | 19 | 34 |
| 2016 | 22 | 18 |
| 2017 | 25 | 30 |
| 2018 | 21 | 35 |
| 2019 | 34 | 36 |
| 2020 | 28 | 51 |
| 2021 | 49 | 41 |
| 2022 | 36 | 21 |
| 2023 | 31 | 39 |
| 2024 | 27 | 27 |
| 2025 | 21 | 30 |
| 2026 | 17 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Prevention of contamination of substrates during gas purging29 Sep 2026US 12,751,244 B2APPLIED Materials.Inc.
- Apparatus for treating substrate and method for treating substrate8 Sep 2026US 12,733,439 B2Semes Co., Ltd.
- Systems for integrated decomposition and scanning of a semiconducting wafer18 Aug 2026US 12,713,869 B2Elemental Scientific, Inc.
- EFEM and method of controlling supply amount of inert gas18 Aug 2026US 12,713,874 B2Sinfonia Technology Co., Ltd.
- Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium11 Aug 2026US 12,707,918 B2Kokusai Electric Corporation
- Operation method and device for cleaning foup8 Oct 2026US 2026/0314317 A1Asia Neo Tech Industrial Co., Ltd.
- Load port1 Oct 2026US 2026/0305238 A1Sinfonia Technology Co., Ltd.
- Foup positional calibration device24 Sep 2026US 2026/0293597 A1Nanoverse Technologies Ltd
- Semiconductor processing system and method for operating the same17 Sep 2026US 2026/0282821 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Automated material handling system17 Sep 2026US 2026/0282823 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Electronic substrate processing system using portable closed containers and its equipments568US 5,621,982 AShinko Electric Co., Ltd. · 1997
- Wafer-mapping load post interface having an effector position sensing device546US 6,013,920 AFortrend Engineering Coirporation · 2000
- Direct loadlock interface538US 5,586,585 AAsyst Technologies, Inc. · 1996
- FOUP opening/closing device and probe apparatus504US 8,267,633 B2Tokyo Electron Limited · 2012
- Treatment apparatus498US 5,562,383 ATokyo Electron Limited · 1996