Apparatus for treating substrate and method for treating substrate
AssigneeSemes Co., Ltd.
InventorChang Jun Park
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Abstract
The present invention provides an apparatus for treating a substrate. The apparatus for treating a substrate comprises: a first module; and a treating module configured to treat the substrate, and the first module includes: a load port on which a container having the substrate accommodated therein is placed; a transfer unit having a hand that transfers the substrate between the load port and the treating module; and an observation unit mounted in the transfer unit and configured to observe a state of the substrate accommodated in the container.
Claims10
An apparatus for treating a substrate, comprising:
- a first module;
- a treating module configured to treat the substrate;
- and
- a controller configured to control operations of the first module,
- wherein the first module includes:
- a load port on which a container having a plurality of slots is placed, the plurality of slots configured to accommodate a plurality of substrates, the substrates including the substrate and at least one other substrate;
- a transfer unit having a hand that transfers the substrate between the load port and the treating module;
- and
- an observation unit mounted in the transfer unit and configured to simultaneously observe states of each of the substrates at a preset reference position,
- wherein the controller is configured to cause the observation unit to perform a primary observation operation at the reference position,
- wherein the primary observation operation includes the observation unit simultaneously observing the states of the substrates, and
- wherein the observation unit is configured to, during the primary observation operation,
- collect time data on the time taken for light to be reflected and received from the substrate after irradiating the light to the substrate accommodated in the container;
- and
- estimate a relative distance between the substrate accommodated in the container according to the time data and the observation unit.
An apparatus for treating a substrate, comprising:
- a first module;
- a treating module configured to treat the substrate, and
- a controller configured to control operations of the first module,
- wherein the first module includes:
- a load port on which a container having a plurality of slots is placed, the plurality of slots configured to accommodate a plurality of substrates, the substrates including the substrate and at least one other substrate;
- a transfer frame disposed between the load port and the treating module and configured to transfer the substrate;
- a transfer unit disposed in the transfer frame and having a hand for transferring the substrate between the load port and the treating module;
- an observation unit installed in the hand and configured to simultaneously observe states of all the substrates accommodated in the container in a state in which the hand is disposed in a preset reference position;
- and
- an auxiliary observation unit installed in the hand at a position not overlapping the observation unit and configured to irradiate a laser toward a specific substrate accommodated in the container while the hand moves vertically and selectively observe the state of the specific substrate,
- wherein the controller is configured to cause the observation unit to perform a primary observation operation at the reference position,
- wherein the primary observation operation includes the observation unit simultaneously observing the states of the substrates, and
- wherein the observation unit is configured to, during the primary observation operation,
- collect time data on the time taken for light to be reflected and received from the substrate after irradiating the light to the substrate accommodated in the container;
- and
- estimate a relative distance between the substrate accommodated in the container according to the time data and the observation unit.
Dependencies are inferred from the claim text.