Systems for integrated decomposition and scanning of a semiconducting wafer

A system for decomposing and scanning a surface of a semiconducting wafer comprising:

• a chamber configured to receive a semiconducting wafer, the chamber defining a first aperture at a top portion of the chamber to receive the semiconducting wafer into an interior region of the chamber, the chamber including
• a ledge at an intermediate portion of the chamber between the top portion of the chamber and a bottom portion of the chamber, the ledge defining a second aperture at the intermediate portion,
• a wafer support configured to hold at least a portion of the semiconducting wafer, the wafer support positionable between at least a first position adjacent the first aperture and a second position adjacent the second aperture,
• a motor system operably coupled with the wafer support, the motor system configured to control a vertical position of the wafer support with respect to the chamber at least to the first position and the second position, and
• a spray aperture formed in a sidewall of the chamber between the first aperture and the second aperture, the spray aperture configured to receive a spray of a decomposition fluid from a spray device that extends no further than an inner periphery of the sidewall during spraying of the decomposition fluid, the decomposition fluid directed into the interior region of the chamber when the wafer support is positioned at the second position by the motor system;
• a lid positionable between an open position and a closed position, the lid having a size and shape to cover the first aperture when in the closed position;
• and
• a scan arm coupled with a nozzle, at least a portion of the scan arm positioned exterior the chamber above the first aperture, the scan arm rotatable to position the nozzle adjacent the semiconducting wafer when the wafer support is positioned at the first position by the motor system and to position the nozzle outside a path of the lid from the open position to the closed position when the wafer support is positioned at the second position by the motor system.