Foup positional calibration device
AssigneeNanoverse Technologies Ltd
InventorsWilliam Robertson, Jeff Albelo
Life of this patent
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AssigneeNanoverse Technologies Ltd
InventorsWilliam Robertson, Jeff Albelo
Estimating the term…
A semiconductor fabrication facility has numerous Si wafer processing modules. Robotic arms transfer the Si wafers to the processing equipment in these modules, retrieving them from their stacked array in a front opening unified pod (FOUP) with their end effectors. The FOUP resides in a load port in an equipment front end module (EFEM). Precision in retrieving the Si wafers is the key to a higher production yield and to minimizing Si wafer culls. The robots can only move about the module based on the module control computer's instructions based on its 3-D mapping of the EFEM, the load port and the FOUP. Often the mapping's 3-D cartesian coordinates are off slightly such that the directional instructions to the robotic arm are slightly off. This system uses dual lidar sensors mounted on a robotic arm in concert with 3-D reference targets on the EFEM and a FOUP alignment tool to calibrate the robot's three-dimensional awareness of both its spatial relation to the fixed elements of the EFEM as well as to Si wafers in a FOUP.
A method to calibrate an EFEM module control computer's three-dimensional mapping in an EFEM calibration program of a Front Opening Unified Pod (FOUP) in an EFEM load port in a semiconductor processing facility, comprising the steps of:
A calibration tool connectable to an EFEM control computer, for calibrating a three-dimensional mapping of a Front Opening Unified Pod (FOUP) when installed into a load port of an Equipment Front End Module (EFEM) comprising:
Dependencies are inferred from the claim text.