Automated material handling system

A method, comprising:

• performing, using a door control valve, a door open operation on a door to move the door from a closed position in which the door covers an opening defined by a wall to an open position in which the door does not cover the opening;
• transferring, while the door is in the open position, a semiconductor wafer through the opening;
• and
• performing, using the door control valve, a door close operation on the door to move the door from the open position to the closed position, wherein performing the door close operation comprises:
• regulating an inlet pressure associated with the door control valve using a first pressure control module;
• and
• regulating a back pressure associated with the door control valve using a second pressure control module.

A door control apparatus comprising:

• a door control valve coupled to a door fitted to an opening defined by a wall, wherein the door is configured to transition between a closed position in which the door covers the opening and an open position in which the door does not cover the opening;
• a first pressure control module coupled to a fluid inlet port defined by the door control valve;
• and
• a second pressure control module coupled to a fluid outlet port defined by the door control valve,
• wherein during a door close operation to move the door from the open position to the closed position, the door control apparatus is configured to:
• regulate an inlet pressure associated with the door control valve using the first pressure control module;
• and
• regulate a back pressure associated with the door control valve using the second pressure control module.