H10P 72/3411
Involving loading and unloading of wafers
Official title: {involving loading and unloading of wafers}
H10P72/3411 (Involving loading and unloading of wafers) appears on 1,404 US grants and 1,299 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,404
- Published applications
- 1,299
- Assignees
- 432
- Inventors
- 2,794
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 8 | 0 |
| 1986 | 10 | 0 |
| 1987 | 13 | 0 |
| 1988 | 16 | 0 |
| 1989 | 17 | 0 |
| 1990 | 19 | 0 |
| 1991 | 13 | 0 |
| 1992 | 17 | 0 |
| 1993 | 21 | 0 |
| 1994 | 20 | 0 |
| 1995 | 17 | 0 |
| 1996 | 17 | 0 |
| 1997 | 33 | 0 |
| 1998 | 48 | 0 |
| 1999 | 38 | 0 |
| 2000 | 53 | 0 |
| 2001 | 44 | 30 |
| 2002 | 44 | 55 |
| 2003 | 44 | 54 |
| 2004 | 40 | 40 |
| 2005 | 22 | 34 |
| 2006 | 19 | 33 |
| 2007 | 24 | 38 |
| 2008 | 18 | 31 |
| 2009 | 9 | 32 |
| 2010 | 21 | 33 |
| 2011 | 21 | 35 |
| 2012 | 20 | 39 |
| 2013 | 22 | 32 |
| 2014 | 29 | 33 |
| 2015 | 39 | 43 |
| 2016 | 36 | 46 |
| 2017 | 32 | 56 |
| 2018 | 55 | 77 |
| 2019 | 71 | 69 |
| 2020 | 73 | 91 |
| 2021 | 67 | 66 |
| 2022 | 59 | 85 |
| 2023 | 60 | 63 |
| 2024 | 60 | 62 |
| 2025 | 50 | 69 |
| 2026 | 42 | 53 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optically activated object mass transfer using multiple optical energy sources29 Sep 2026US 12,751,252 B2Genesee Valley Innovations, LLC
- Apparatus for treating substrate22 Sep 2026US 12,745,587 B2Semes Co., Ltd.
- Substrate processing apparatus and substrate processing method22 Sep 2026US 12,745,590 B2Tokyo Electron Limited
- Position determination apparatus for robot detection laser sensor system in FOUP movable by OHT15 Sep 2026US 12,740,367 B2Samsung Electronics Co., Ltd.
- Apparatus for treating substrate and method for treating substrate8 Sep 2026US 12,733,439 B2Semes Co., Ltd.
- Substrate holder, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium1 Oct 2026US 2026/0305236 A1Kokusai Electric Corporation
- Substrate processing system, storage module, and substrate processing method1 Oct 2026US 2026/0305237 A1Tokyo Electron Limited
- Load port, abnormal state determination method, and storage medium1 Oct 2026US 2026/0305244 A1Hirata Corporation
- Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording medium24 Sep 2026US 2026/0293590 A1Kokusai Electric Corporation
- Semiconductor processing system and method for operating the same17 Sep 2026US 2026/0282821 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Modular wafer transport and processing system655US 4,917,556 AVarian Associates, Inc. · 1990
- Method and apparatus for batch processing a semiconductor wafer605US 5,167,716 AGaSonics, Inc. · 1992
- Wafer probing test machine597US 5,278,494 ATokyo Electron Yamanashi Limited · 1994
- Wafer handling apparatus and method583US 4,789,294 ACanon Kabushiki Kaisha · 1988