H10P 72/3412
Batch transfer of wafers
Official title: {Batch transfer of wafers}
H10P72/3412 (Batch transfer of wafers) appears on 622 US grants and 563 published applications in this corpus.
Search patents in H10P- Granted patents
- 622
- Published applications
- 563
- Assignees
- 236
- Inventors
- 1,305
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 8 | 0 |
| 1988 | 9 | 0 |
| 1989 | 6 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 16 | 0 |
| 1994 | 7 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 24 | 0 |
| 1998 | 23 | 0 |
| 1999 | 21 | 0 |
| 2000 | 19 | 0 |
| 2001 | 14 | 11 |
| 2002 | 20 | 30 |
| 2003 | 27 | 27 |
| 2004 | 21 | 17 |
| 2005 | 10 | 22 |
| 2006 | 10 | 11 |
| 2007 | 10 | 16 |
| 2008 | 8 | 15 |
| 2009 | 4 | 14 |
| 2010 | 5 | 11 |
| 2011 | 11 | 16 |
| 2012 | 10 | 25 |
| 2013 | 10 | 18 |
| 2014 | 13 | 18 |
| 2015 | 23 | 19 |
| 2016 | 18 | 17 |
| 2017 | 11 | 23 |
| 2018 | 19 | 24 |
| 2019 | 30 | 21 |
| 2020 | 22 | 45 |
| 2021 | 28 | 28 |
| 2022 | 23 | 28 |
| 2023 | 23 | 21 |
| 2024 | 26 | 32 |
| 2025 | 21 | 37 |
| 2026 | 13 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optically activated object mass transfer using multiple optical energy sources29 Sep 2026US 12,751,252 B2Genesee Valley Innovations, LLC
- Substrate processing apparatus8 Sep 2026US 12,733,451 B2SCREEN Holdings Co., Ltd.
- Substrate processing method21 Jul 2026US 12,690,416 B2SCREEN Holdings Co., Ltd.
- Cassette housing, prober, server rack, and storage system14 Jul 2026US 12,685,083 B2Kioxia Corporation
- Buffer chamber, substrate treating apparatus and substrate treating method9 Jun 2026US 12,649,164 B2Semes Co., Ltd.
- Substrate holder, substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium1 Oct 2026US 2026/0305236 A1Kokusai Electric Corporation
- Method of displaying substrate arrangement data, method of manufacturing semiconductor device, non-transitory computer-readable recording medium and substrate processing apparatus10 Sep 2026US 2026/0271661 A1Kokusai Electric Corporation
- Wafer handling system and method3 Sep 2026US 2026/0262478 A1Service Support Specialties, Inc.
- Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium20 Aug 2026US 2026/0247889 A1Kokusai Electric Corporation
- Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, recording medium, and transfer machine13 Aug 2026US 2026/0234793 A1Kokusai Electric Corporation
Most cited
By later US patents
- Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber658US 6,315,512 B1Mattson Technology, Inc. · 2001
- Semiconductor substrate transfer apparatus and semiconductor substrate processing apparatus equipped with the same540US 7,618,226 B2ASM Japan K .K. · 2009
- Apparatus and method for loading and unloading wafers529US 4,775,281 ATeradyne, Inc. · 1988
- Transfer apparatus492US 4,466,766 ARuska Instrument Corporation · 1984
- Substrate transport apparatus with double substrate holders489US 6,158,941 ABrooks Automation, Inc. · 2000