Substrate processing apparatus

A substrate processing apparatus that processes a substrate, the apparatus comprising:

• a batch type processing unit that collectively processes a plurality of substrates in a vertical posture;
• a single wafer type processing unit that processes one substrate in a horizontal posture;
• a posture turning unit that turns a vertical posture to a horizontal posture of the plurality of substrates processed by the batch type processing unit;
• a first transport unit that transports the plurality of substrates processed by the batch type processing unit to the posture turning unit;
• and
• a second transport unit that transports the plurality of substrates brought into a horizontal posture by the posture turning unit to the single wafer type processing unit, wherein
• the posture turning unit holds the plurality of substrates in a state where an interval above upper surfaces of the plurality of substrates in a second groove is narrower than a first groove when turning a posture of the plurality of substrates, and holds the plurality of substrates in a state where an interval above upper surfaces of the plurality of substrates in the first groove is wider than the second groove when transferring the plurality of substrates after the plurality of substrates are brought into a horizontal posture,
• the posture turning unit includes
• a reversing chuck that includes a pair of chuck members that are disposed to face each other in a radial direction of the plurality of substrates and clamp peripheral edge portions of the plurality of substrates,
• a drive mechanism that moves the reversing chuck in a horizontal direction over at least two positions of a first interval for transferring the plurality of substrates between the first transport unit and the second transport unit and a second interval that is narrower than the first interval and where the plurality of substrates are clamped, and
• a rotating mechanism that rotates the reversing chuck in a plane direction of the plurality of substrates,
• the reversing chuck includes a first groove that allows the plurality of substrates to move in a thickness direction, and a second groove formed on an outer side of the plurality of substrates than an outer end of the first groove in the radial direction of the plurality of substrates and clamps the plurality of substrates in a radial direction while restricting movement of the plurality of substrates in a thickness direction,
• when the reversing chuck receives the plurality of substrates from the first transport unit, the reversing chuck is set to the first interval by the drive mechanism so that each of the plurality of substrates is accommodated in the first groove,
• when the plurality of substrates are rotated in a horizontal posture by the rotating mechanism, the reversing chuck is set to the second interval by the drive mechanism so that each of the plurality of substrates is clamped in the second groove, and
• when the second transport unit receives the plurality of substrates from the reversing chuck, the reversing chuck is set to the first interval by the drive mechanism so that the lower surfaces of the plurality of substrates are abutted and supported by the first groove.