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US 12,685,083 B2Granted
Cassette housing, prober, server rack, and storage system
AssigneeKioxia Corporation
InventorsTatsuro Hitomi, Yasuhito Yoshimizu, Arata Inoue, Hiroyuki Dohmae, Kazuhito Hayasaka, Tomoya Sanuki
Life of this patent
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Abstract
According to one embodiment, a cassette housing includes a storage unit, a probe card, and a container. The storage unit stores a semiconductor wafer including a plurality of nonvolatile memory chips. The probe card includes a probe. The probe is configured to be brought into contact with a pad electrode provided on the semiconductor wafer. The container contains heat transfer fluid for lowering or raising temperature of one or both of the probe card and the semiconductor wafer stored in the storage unit.
Claims10
A cassette housing comprising:
- a storage unit configured to store a semiconductor wafer that includes a plurality of nonvolatile memory chips;
- a probe card that includes a probe configured to be brought into contact with a pad electrode provided on the semiconductor wafer;
- and
- a container configured to contain heat transfer fluid for lowering or raising temperature of one or both of the probe card and the semiconductor wafer stored in the storage unit, wherein
- in a state in which (A) the storage unit stores the semiconductor wafer and (B) the probe of the probe card is brought into contact with the pad electrode provided on the semiconductor wafer, the cassette housing is movable to a stocker.
2 more elements
A storage system comprising:
- a prober;
- and
- a server rack,
- wherein
- the server rack includes:
- a processor;
- a first storage unit configured to store a cased memory device, the cased memory device including a first container, a memory device, and a housing in which the memory device is mounted, the first container being configured to contain heat transfer fluid for lowering or raising temperature of the memory device, the memory device being a semiconductor wafer and including a plurality of nonvolatile memory chips to or from which writing or reading of data is to be required from the processor, the housing being a cassette housing in which a probe card is disposed, the probe card including a probe configured to be brought into contact with a pad electrode provided on the semiconductor wafer;
- a first fluid device configured to inject or discharge the heat transfer fluid to or from the first container when the cased memory device is stored in the first storage unit, for lowering or raising temperature of one or both of the semiconductor wafer and the probe card;
- and
- a second container configured to contain the heat transfer fluid, wherein
- the prober includes:
- an attachment/detachment device configured to integrate or separate the semiconductor wafer and the cassette housing with or from each other;
- and
- a third container configured to contain the heat transfer fluid.
11 more elements
A storage system comprising:
- a prober;
- and
- a server rack,
- wherein
- the server rack includes:
- a processor;
- a first storage unit configured to store a cased memory device, the cased memory device including a first container, a memory device, and a housing in which the memory device is mounted, the first container being configured to contain heat transfer fluid for lowering or raising temperature of the memory device, the memory device including a plurality of nonvolatile memory chips to or from which writing or reading of data is to be required from the processor;
- a first fluid device configured to inject or discharge the heat transfer fluid to or from the first container when the cased memory device is stored in the first storage unit;
- and
- a second container configured to contain the heat transfer fluid, wherein
- the prober includes:
- an attachment/detachment device configured to integrate or separate the memory device and the housing with or from each other;
- and
- a third container configured to contain the heat transfer fluid.
11 more elements
Dependencies are inferred from the claim text.