H10P 72/50
Handling or holding of wafers, substrates or devices during manufacture or treatment
Official title: for positioning, orientation or alignment
H10P72/50 (Handling or holding of wafers, substrates or devices during manufacture or treatment) appears on 3,511 US grants and 3,771 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,511
- Published applications
- 3,771
- Assignees
- 990
- Inventors
- 7,584
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 8 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 8 | 0 |
| 1981 | 5 | 0 |
| 1982 | 6 | 0 |
| 1983 | 9 | 0 |
| 1984 | 12 | 0 |
| 1985 | 12 | 0 |
| 1986 | 11 | 0 |
| 1987 | 17 | 0 |
| 1988 | 24 | 0 |
| 1989 | 26 | 0 |
| 1990 | 29 | 0 |
| 1991 | 31 | 0 |
| 1992 | 38 | 0 |
| 1993 | 37 | 0 |
| 1994 | 31 | 0 |
| 1995 | 28 | 0 |
| 1996 | 23 | 0 |
| 1997 | 27 | 0 |
| 1998 | 49 | 0 |
| 1999 | 47 | 0 |
| 2000 | 82 | 0 |
| 2001 | 84 | 31 |
| 2002 | 90 | 104 |
| 2003 | 90 | 102 |
| 2004 | 81 | 106 |
| 2005 | 79 | 105 |
| 2006 | 90 | 76 |
| 2007 | 56 | 71 |
| 2008 | 38 | 86 |
| 2009 | 44 | 88 |
| 2010 | 43 | 77 |
| 2011 | 61 | 53 |
| 2012 | 55 | 73 |
| 2013 | 60 | 97 |
| 2014 | 71 | 103 |
| 2015 | 79 | 113 |
| 2016 | 117 | 119 |
| 2017 | 123 | 168 |
| 2018 | 129 | 197 |
| 2019 | 188 | 228 |
| 2020 | 220 | 267 |
| 2021 | 174 | 243 |
| 2022 | 176 | 284 |
| 2023 | 203 | 257 |
| 2024 | 207 | 254 |
| 2025 | 222 | 252 |
| 2026 | 157 | 217 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wafer alignment assembly of the solder reflow system29 Sep 2026US 12,751,247 B2Taiwan Semiconductor Manufacturing Company.Ltd
- High precision edge ring centering for substrate processing systems22 Sep 2026US 12,744,191 B2Lam Research Corporation
- Reticle exchange device with reticle levitation22 Sep 2026US 12,745,594 B2Massachusetts Institute of Technology
- Method and device for the alignment of a substrate22 Sep 2026US 12,745,600 B2EV Group E. Thallner GmbH
- Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method15 Sep 2026US 12,736,887 B2ASML Netherlands B. V.
- Bonding apparatus, bonding system, and bonding method8 Oct 2026US 2026/0314302 A1Tokyo Electron Limited
- Substrate marking apparatus and substrate marking method using the same8 Oct 2026US 2026/0314310 A1Samsung Electronics Co., Ltd.
- Mass transfer apparatus and mass transfer method thereof8 Oct 2026US 2026/0314318 A1Century Technology (Shenzhen) Corporation Limited
- Striker for wafer bonding8 Oct 2026US 2026/0314319 A1Tokyo Electron Limited
- A positioning system for positioning an object within an xyz-system of coordinates1 Oct 2026US 2026/0295859 A1Vdl Enabling Technologies Group B.V.
Most cited
By later US patents
- Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device918US 5,969,441 AASM Lithography B. V. · 1999
- Rotatable substrate supporting mechanism with temperature sensing device for use in chemical vapor deposition equipment622US 4,821,674 A1989
- Wafer out-of-pocket detection method571US 6,274,878 B1APPLIED Materials.Inc. · 2001
- Stage device with frame-shaped member movable in at least three degrees of freedom within a two-dimensional plane560US 7,489,389 B2Nikon Corporation · 2009
- Heat treatment jig for semiconductor substrate555US 7,329,947 B2Sumitomo Mitsubishi Silicon Corporation · 2008