H10P 72/53
Using optical controlling means
Official title: {using optical controlling means}
H10P72/53 (Using optical controlling means) appears on 1,749 US grants and 1,980 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,749
- Published applications
- 1,980
- Assignees
- 558
- Inventors
- 4,012
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 5 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 7 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 12 | 0 |
| 1992 | 13 | 0 |
| 1993 | 12 | 0 |
| 1994 | 11 | 0 |
| 1995 | 15 | 0 |
| 1996 | 11 | 0 |
| 1997 | 14 | 0 |
| 1998 | 20 | 0 |
| 1999 | 15 | 0 |
| 2000 | 33 | 0 |
| 2001 | 43 | 17 |
| 2002 | 44 | 52 |
| 2003 | 40 | 52 |
| 2004 | 44 | 54 |
| 2005 | 40 | 42 |
| 2006 | 53 | 41 |
| 2007 | 25 | 35 |
| 2008 | 18 | 39 |
| 2009 | 21 | 32 |
| 2010 | 21 | 45 |
| 2011 | 29 | 19 |
| 2012 | 28 | 32 |
| 2013 | 24 | 48 |
| 2014 | 30 | 49 |
| 2015 | 38 | 52 |
| 2016 | 52 | 53 |
| 2017 | 64 | 90 |
| 2018 | 57 | 92 |
| 2019 | 98 | 122 |
| 2020 | 129 | 148 |
| 2021 | 98 | 127 |
| 2022 | 96 | 159 |
| 2023 | 114 | 152 |
| 2024 | 115 | 147 |
| 2025 | 133 | 150 |
| 2026 | 87 | 131 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High precision edge ring centering for substrate processing systems22 Sep 2026US 12,744,191 B2Lam Research Corporation
- Method and device for the alignment of a substrate22 Sep 2026US 12,745,600 B2EV Group E. Thallner GmbH
- Position determination apparatus for robot detection laser sensor system in FOUP movable by OHT15 Sep 2026US 12,740,367 B2Samsung Electronics Co., Ltd.
- Method and apparatus for aligning wafer using laser scanner, semiconductor transfer device15 Sep 2026US 12,740,373 B2Semes Co., Ltd.
- Method of operation of semiconductor processing tool15 Sep 2026US 12,740,374 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Bonding apparatus, bonding system, and bonding method8 Oct 2026US 2026/0314302 A1Tokyo Electron Limited
- Substrate marking apparatus and substrate marking method using the same8 Oct 2026US 2026/0314310 A1Samsung Electronics Co., Ltd.
- Mass transfer apparatus and mass transfer method thereof8 Oct 2026US 2026/0314318 A1Century Technology (Shenzhen) Corporation Limited
- Bonding apparatus, bonding system, and bonding method1 Oct 2026US 2026/0305226 A1Tokyo Electron Limited
- Device and method for manufacturing display panel, and method of manufacturing electronic device including display panel1 Oct 2026US 2026/0305228 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Wafer out-of-pocket detection method571US 6,274,878 B1APPLIED Materials.Inc. · 2001
- System and method for on-the-fly eccentricity recognition543US 6,990,430 B2Brooks Automation, Inc. · 2006
- Wafer processing apparatus with wafer alignment device543US 7,963,736 B2ASM Japan K .K. · 2011
- Method and apparatus for transferring wafers between cassettes and a boat541US 4,770,590 ASilicon Valley Group, Inc. · 1988
- Apparatus and method for calculating a wafer position in a processing chamber under process conditions510US 9,117,866 B2ASM IP Holding B. V. · 2015