Bonding apparatus, bonding system, and bonding method
AssigneeTokyo Electron Limited
InventorTetsuya MAKI
Life of this patent
Estimating the term…
Abstract
A bonding apparatus 41 includes a first holder 230, a second holder 231, a movable member 281a and a motor 281c. The first holder 230 is configured to attract and hold a first substrate W 1 from above. The second holder 231 is disposed below the first holder 230, and configured to attract and hold a second substrate W2 from below. The movable member 281a is configured to be linearly movable along a vertical direction, and also configured to press, with a tip end thereof, a central portion of the first substrate W1. The motor 281c is configured to move the movable member 281a along the vertical direction.
Claims20
A bonding apparatus, comprising:
- a first holder attracting and holding a first substrate from above;
- a second holder disposed below the first holder, and attracting and holding a second substrate from below;
- a movable member linearly movable along a vertical direction, and also pressing, with a tip end thereof, a central portion of the first substrate;
- and
- a motor moving the movable member along the vertical direction.
(canceled)
A bonding method, comprising:
- attracting and holding a first substrate from above the first holder by using a first holder;
- attracting and holding a second substrate by using a second holder that is disposed below the first holder;
- and
- by using a motor, linearly moved moving the movable member between a standby position spaced apart from the first substrate, a pre-contact position that is closer to the first substrate than the standby position and where the movable member is not in contact with the first substrate, and a contact position where the movable member comes into contact with the first substrate, the motor being linearly moved along a vertical direction and pressing, with a tip end of the motor, a central portion of the first substrate,
- wherein, in the moving of the movable member, a moving speed of the movable member from the pre-contact position to the contact position is lower than a moving speed of the movable member from the standby position to the pre-contact position.
A bonding method, comprising:
- attracting and holding a first substrate from above the first substrate by using a first holder;
- attracting and holding a second substrate by using a second holder that is disposed below the first holder;
- by using a motor, moving the movable member between a standby position spaced apart from the first substrate and a contact position where the movable member comes into contact with the first substrate, the motor being linearly moved along a vertical direction and pressing, with a tip end of the motor, a central portion of the first substrate;
- imaging a bonding surface of the first substrate held by the first holder or the second substrate held by the second holder by using an imaging device;
- and
- by using a position aligning device, performing the positional alignment between the first substrate and the second substrate in the horizontal direction based on an imaging result from the imaging device.
Dependencies are inferred from the claim text.