Bonding apparatus, bonding system, and bonding method

A bonding method, comprising:

• holding, by a chip carrier holder, a chip carrier from above the chip carrier in a state that multiple chips are held by the chip carrier and a bonding surface of each of the multiple chips faces downwards;
• holding, by a substrate holder, a substrate from below the substrate in a state that a bonding surface of the substrate faces upwards;
• by a first chip transfer mechanism, receiving the chip from the chip carrier and transferring the chip with the bonding surface of the chip facing downwards;
• and
• by a second chip transfer mechanism, receiving the chip from the first chip transfer mechanism and bonding the chip to the substrate with the bonding surface of the chip facing downwards.

A bonding system, comprising:

• a chip carrier holder holding a chip carrier from above the chip carrier in a state that multiple chips are held by the chip carrier and a bonding surface of each of the multiple chips faces downwards;
• a substrate holder holding a substrate from below the substrate in a state that a bonding surface of the substrate faces upwards;
• a first chip transfer mechanism including a driver and receiving the chip from the chip carrier and transferring the chip with the bonding surface of the chip facing downwards;
• a second chip transfer mechanism including a driver and receiving the chip from the first chip transfer mechanism and bonding the chip to the substrate with the bonding surface of the chip facing downwards;
• a first activating apparatus activating the bonding surface of the chip with the chip held by the electrostatic carrier;
• a first hydrophilizing apparatus hydrophilizing the bonding surface of the chip with the chip held by the electrostatic carrier;
• and
• a transfer device transferring the electrostatic carrier to the first activating apparatus, the first hydrophilizing apparatus, and the bonding apparatus in this order, wherein
• the first activating apparatus is a plasma processing apparatus,
• the first activating apparatus irradiates the bonding surface of the chip with oxygen ions to activate the bonding surface of the chip, and
• the first hydrophilizing apparatus supplies deionized water onto the chip while the chip carrier is rotated.