Method and apparatus for aligning wafer using laser scanner, semiconductor transfer device

An apparatus for aligning a wafer, using a laser scanner, the apparatus comprising:

• a laser scanner disposed on a rear side or a lower side of the wafer and irradiating a laser toward the wafer;
• and
• a detection unit obtaining location information of at least three points on a wafer edge by using a distance corresponding to a laser irradiation direction to the wafer edge in an image obtained by the laser scanner,
• wherein the detection unit calculates a center point of the wafer using the obtained location information of the at least three points of the wafer edge, and detects whether the calculated center point is within a preset tolerance range to determine a wafer alignment state,
• wherein the detection unit is configured to extract first location information, second location information, and third location information with respect to the wafer edge in the image and to detect whether a deviation of the extracted first location information, second location information and third location information is within a preset deviation threshold range, and
• wherein the detection unit is configured to calculate the center point of the wafer using a radius of the wafer and at least two pieces of location information of the first location information, the second location information, and the third location information, when it is detected that the deviation of the first location information, the second location information, and the third location information is within the preset deviation threshold range, and
• is configured to delete the first location information. the second location information, and the third location information and to acquire location information of a new wafer edge, when it is detected that the deviation of the first location information, the second location information, and the third location information is out of the preset deviation threshold range.

A semiconductor transfer device comprising:

• a wafer seating portion configured to support a wafer;
• a robot arm seating the wafer on the wafer seating portion;
• one laser scanner disposed on the robot arm located on a rear side or a lower side of the wafer and irradiating a laser to a wafer edge seated on the wafer seating portion;
• and
• an interface unit including a detection unit detecting the wafer edge in an image acquired by the laser scanner and a communication unit communicating with the robot arm and the laser scanner,
• wherein the detection unit extracts location information of two points of the wafer edge in which a location information deviation of the two points of the wafer edge is within a preset deviation threshold range from among obtained location information of at least three points of the wafer edge, calculates a center point of the wafer using extracted location information of the two points of the wafer edge and mechanical information of the wafer or the wafer seating portion, and detects whether the calculated center point is within a preset tolerance range to determine a wafer alignment state,
• wherein the detection unit is configured to extract first location information, second location information, and third location information with respect to the wafer edge in the image and to detect whether a deviation of the extracted first location information, second location information and third location information is within a preset deviation threshold range,
• wherein the detection unit is configured to calculate the center point of the wafer using a radius of the wafer and at least two pieces of location information of the first location information, the second location information, and the third location information, when it is detected that the deviation of the first location information, the second location information, and the third location information is within the preset deviation threshold range, and
• is configured to delete the first location information, the second location information. and the third location information and to acquire location information of a new wafer edge, when it is detected that the deviation of the first location information, the second location information. and the third location information is out of the preset deviation threshold range.