H10P 72/70
Handling or holding of wafers, substrates or devices during manufacture or treatment
Official title: for supporting or gripping
H10P72/70 (Handling or holding of wafers, substrates or devices during manufacture or treatment) appears on 26,313 US grants and 33,129 published applications in this corpus.
Search patents in H10P- Granted patents
- 26,313
- Published applications
- 33,129
- Assignees
- 3,334
- Inventors
- 37,394
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 9 | 0 |
| 1978 | 5 | 0 |
| 1979 | 7 | 0 |
| 1980 | 7 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 13 | 0 |
| 1984 | 16 | 0 |
| 1985 | 28 | 0 |
| 1986 | 31 | 0 |
| 1987 | 33 | 0 |
| 1988 | 49 | 0 |
| 1989 | 47 | 0 |
| 1990 | 52 | 0 |
| 1991 | 53 | 0 |
| 1992 | 91 | 0 |
| 1993 | 102 | 0 |
| 1994 | 123 | 0 |
| 1995 | 128 | 0 |
| 1996 | 132 | 0 |
| 1997 | 150 | 0 |
| 1998 | 246 | 0 |
| 1999 | 266 | 0 |
| 2000 | 329 | 0 |
| 2001 | 369 | 167 |
| 2002 | 401 | 525 |
| 2003 | 440 | 627 |
| 2004 | 452 | 661 |
| 2005 | 429 | 707 |
| 2006 | 427 | 702 |
| 2007 | 396 | 755 |
| 2008 | 375 | 870 |
| 2009 | 422 | 825 |
| 2010 | 646 | 920 |
| 2011 | 722 | 888 |
| 2012 | 707 | 894 |
| 2013 | 749 | 952 |
| 2014 | 803 | 975 |
| 2015 | 883 | 1110 |
| 2016 | 964 | 1234 |
| 2017 | 1106 | 1469 |
| 2018 | 1169 | 1700 |
| 2019 | 1443 | 1946 |
| 2020 | 1668 | 2289 |
| 2021 | 1645 | 2276 |
| 2022 | 1713 | 2387 |
| 2023 | 1697 | 2337 |
| 2024 | 1754 | 2268 |
| 2025 | 1836 | 2201 |
| 2026 | 1155 | 1444 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus6 Oct 2026US 12,753,507 B2Tokyo Electron Limited
- External cooling assembly for substrate support6 Oct 2026US 12,755,943 B2APPLIED Materials.Inc.
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Semiconductor manufacturing apparatus and semiconductor device manufacturing method6 Oct 2026US 12,755,946 B2Kioxia Corporation
- Semiconductor cleaning apparatus and method8 Oct 2026US 2026/0307113 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Transfer robot8 Oct 2026US 2026/0307918 A1Kabushiki Kaisha Yaskawa Denki
- Rotary electrical feedthrough integration for process chamber8 Oct 2026US 2026/0308750 A1APPLIED Materials.Inc.
- Reactant vapor delivery systems for semiconductor processing tools and methods8 Oct 2026US 2026/0308757 A1ASM IP Holding B. V.
- System and method to maintain constant clamping pressure during chamber rebooting and power failure instances8 Oct 2026US 2026/0311974 A1Lam Research Corporation
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Transportation apparatus and drive mechanism1,050US 7,837,425 B2Tokyo Electron Limited · 2010
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996