H10P 72/74
Using temporarily an auxiliary support
Official title: {using temporarily an auxiliary support}
H10P72/74 (Using temporarily an auxiliary support) appears on 13,969 US grants and 17,331 published applications in this corpus.
Search patents in H10P- Granted patents
- 13,969
- Published applications
- 17,331
- Assignees
- 1,889
- Inventors
- 17,076
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 11 | 0 |
| 1988 | 14 | 0 |
| 1989 | 13 | 0 |
| 1990 | 12 | 0 |
| 1991 | 10 | 0 |
| 1992 | 30 | 0 |
| 1993 | 47 | 0 |
| 1994 | 62 | 0 |
| 1995 | 48 | 0 |
| 1996 | 56 | 0 |
| 1997 | 59 | 0 |
| 1998 | 88 | 0 |
| 1999 | 91 | 0 |
| 2000 | 113 | 0 |
| 2001 | 145 | 90 |
| 2002 | 191 | 273 |
| 2003 | 221 | 313 |
| 2004 | 236 | 358 |
| 2005 | 254 | 416 |
| 2006 | 260 | 394 |
| 2007 | 252 | 401 |
| 2008 | 237 | 464 |
| 2009 | 268 | 498 |
| 2010 | 413 | 532 |
| 2011 | 483 | 549 |
| 2012 | 434 | 513 |
| 2013 | 471 | 513 |
| 2014 | 479 | 515 |
| 2015 | 540 | 571 |
| 2016 | 572 | 687 |
| 2017 | 661 | 739 |
| 2018 | 659 | 821 |
| 2019 | 784 | 979 |
| 2020 | 877 | 1158 |
| 2021 | 879 | 1190 |
| 2022 | 885 | 1149 |
| 2023 | 873 | 1167 |
| 2024 | 844 | 1223 |
| 2025 | 885 | 1128 |
| 2026 | 475 | 690 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10P 72/7416Used during dicing or grinding4,923
- H10P 72/7402Wafer tapes3,814
- H10P 72/7424Used as a support during the manufacture of self-supporting substrates3,780
- H10P 72/743Used as a support during manufacture of interconnect decals or build up2,947
- H10P 72/744Details of chemical or physical process used for separating the auxiliary support2,904
- H10P 72/7422Used to protect an active side of a device or wafer2,012
- H10P 72/7412The auxiliary support including means facilitating the separation of a device or1,452
- H10P 72/7434Used in a transfer process involving at least two transfer steps, i.e.1,399
All 16 subgroupsShow fewer
- H10P 72/7436Used to support a device or a wafer when forming electrical connections1,395
- H10P 72/7432Used in a transfer process involving transfer directly from an origin substrate1,083
- H10P 72/7428Used to support diced chips prior to mounting877
- H10P 72/7426Used as a support during build up manufacturing of active devices693
- H10P 72/7438With parts of the auxiliary support remaining in the finished device682
- H10P 72/7448The bond interface between the auxiliary support and the wafer comprising two374
- H10P 72/741The auxiliary support including a cavity for storing a finished or partly307
- H10P 72/7408The auxiliary support including alignment aids169
Recent patents
- Carrier tape system and methods of making and using the same6 Oct 2026US 12,753,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Workpiece tape removing6 Oct 2026US 12,757,673 B2Yangtze Memory Technologies Co., Ltd.
- Semiconductor manufacturing device, wafer mounting device, dicing device, and semiconductor manufacturing method6 Oct 2026US 12,757,685 B2Mitsubishi Electric Corporation
- Method of manufacturing semiconductor packages6 Oct 2026US 12,757,759 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Light emitting assembly with raised adhesive layer6 Oct 2026US 12,757,789 B2Xiamen San'an Optoelectronics Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0313918 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma diced wafers and methods thereof8 Oct 2026US 2026/0314321 A1UTAC Headquarters Pte. Ltd.
- Method for producing semiconductor device and layered object for semiconductor device8 Oct 2026US 2026/0314322 A1Mitsui Chemicals, Inc.
- Semiconductor package and method8 Oct 2026US 2026/0314498 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Methods and apparatus of wafer level package for heterogeneous integration technology1,051US 9,111,949 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- 3D packages and methods for forming the same974US 9,299,649 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Structure and method for 3D IC package971US 8,993,380 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015