H10P 72/7422
Used to protect an active side of a device or wafer
Official title: {used to protect an active side of a device or wafer}
H10P72/7422 (Used to protect an active side of a device or wafer) appears on 2,012 US grants and 2,455 published applications in this corpus.
Search patents in H10P- Granted patents
- 2,012
- Published applications
- 2,455
- Assignees
- 431
- Inventors
- 3,366
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 4 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 6 | 1 |
| 2002 | 13 | 19 |
| 2003 | 15 | 31 |
| 2004 | 27 | 39 |
| 2005 | 32 | 60 |
| 2006 | 27 | 66 |
| 2007 | 35 | 68 |
| 2008 | 42 | 68 |
| 2009 | 39 | 48 |
| 2010 | 61 | 67 |
| 2011 | 58 | 91 |
| 2012 | 64 | 104 |
| 2013 | 79 | 141 |
| 2014 | 102 | 146 |
| 2015 | 145 | 176 |
| 2016 | 144 | 202 |
| 2017 | 182 | 157 |
| 2018 | 149 | 135 |
| 2019 | 128 | 138 |
| 2020 | 127 | 138 |
| 2021 | 126 | 122 |
| 2022 | 106 | 122 |
| 2023 | 92 | 108 |
| 2024 | 79 | 91 |
| 2025 | 80 | 82 |
| 2026 | 38 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing laminate and kit of adhesive compositions1 Sep 2026US 12,723,176 B2Nissan Chemical Corporation
- Chip bonding method11 Aug 2026US 12,707,935 B2Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Protection film, method for affixing same, and method for manufacturing semiconductor component28 Jul 2026US 12,691,669 B2Mitsui Chemicals Ict Materia, Inc.
- Device wafer processing method9 Jun 2026US 12,652,978 B2Disco Corporation
- Manufacturing method of semiconductor device26 May 2026US 12,642,029 B2Denso Corporation
- Manufacturing method of semiconductor device10 Sep 2026US 2026/0271647 A1Denso Corporation
- Method for producing thin wafer, wafer laminate, and temporary adhesive for wafer processing27 Aug 2026US 2026/0255921 A1Shin-Etsu Chemical Co., Ltd.
- Release agent composition for light irradiation release, laminate, and method for producing processed semiconductor substrate or electronic device layer20 Aug 2026US 2026/0242637 A1Nissan Chemical Corporation
- Method for processing plate substrate20 Aug 2026US 2026/0247920 A1Denka Company Limited
- Method for manufacturing plurality of thin wafers13 Aug 2026US 2026/0239923 A1Denka Company Limited
Most cited
By later US patents
- Method of stacking semiconductor substrates for fabrication of three-dimensional integrated circuit476US 5,087,585 ANEC Corporation · 1992
- Heterogeneously integrated microsystem-on-a-chip337US 7,335,972 B2Sandia Corporation · 2008
- Methods for surface attachment of flipped active componenets316US 8,889,485 B2Semprius, Inc. · 2014
- Backside method for fabricating semiconductor components with conductive interconnects311US 7,393,770 B2Micron Technology, Inc. · 2008
- Semiconductor package280US 8,816,407 B2Samsung Electronics Co., Ltd. · 2014