Chip bonding method
AssigneeWuhan Xinxin Semiconductor Manufacturing Co., Ltd.
InventorsWanli Guo, Tianjian Liu
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Abstract
A die bonding method includes temporarily bonding a first carrier wafer to a front side of a device wafer, so that a back-side connection structure can be formed on a back side of the device wafer to lead out an interconnect structure in the device wafer to the back side of the device wafer. Moreover, through bonding a second carrier wafer to the back side of the device wafer, the first carrier wafer can be debonded. After the device wafer and the second carrier wafer are debonded, a second bonding adhesive is retained in order to provide protection to the back side of the device wafer during the subsequent dicing of the device wafer and to avoid particles or etching by-products produced during the dicing process from adhering to the back side of the device wafer.
Claims13
A die bonding method, comprising:
- providing a device wafer, coating a first bonding adhesive on a front side of the device wafer and temporarily bonding a first carrier wafer to the front side of the device wafer;
- forming a first hybrid bonding structure on a back side of the device wafer;
- coating a second bonding adhesive on the first hybrid bonding structure and temporarily bonding a second carrier wafer to the first hybrid bonding structure;
- debonding the device wafer and the first carrier wafer, and removing the first bonding adhesive;
- debonding the device wafer and the second carrier wafer, and the second bonding adhesive being retained;
- dicing the device wafer from the back side of the device wafer, thereby separating the device wafer into a plurality of individual dies;
- and
- removing the second bonding adhesive and providing a target wafer, a surface of the target wafer having a second hybrid bonding structure formed thereon, and bonding back sides of good dies to the target wafer with an aid of the first hybrid bonding structure and the second hybrid bonding structure.
Dependencies are inferred from the claim text.