Method for manufacturing plurality of thin wafers

A method for manufacturing a plurality of thin wafers, the method comprising:

• (1) bonding a substrate of a thin wafer and an optically transparent support member via a composition for temporary fixing containing the following components (A) to (C)
• (A) polymerizable component containing (meth)acrylate,
• (B) photoradical polymerization initiator, and
• (C) ultraviolet absorber having a polymerizable functional group;
• (2) irradiating light having a wavelength of 350 nm to 700 nm from the support member side to cure the composition for temporary fixing to form an adhesive layer, and bonding the substrate and the support member;
• (3) processing a surface of the substrate to form a thin wafer;
• (4) irradiating light having a wavelength of 385 nm or less from the support member side to decompose the adhesive layer and peel the thin wafer from the support member;
• (5) cleaning the support member for use in manufacturing a next thin wafer;
• and
• (6) repeating (1) to (5) above at least once, wherein
• in (1), a layer containing carbon black is not interposed between the substrate and the support member.