H10P 72/7432
Used in a transfer process involving transfer directly from an origin substrate
Official title: {used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate}
H10P72/7432 (Used in a transfer process involving transfer directly from an origin substrate) appears on 1,083 US grants and 1,179 published applications in this corpus.
Search patents in H10P- Granted patents
- 1,083
- Published applications
- 1,179
- Assignees
- 371
- Inventors
- 1,951
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 7 | 0 |
| 1994 | 13 | 0 |
| 1995 | 10 | 0 |
| 1996 | 12 | 0 |
| 1997 | 9 | 0 |
| 1998 | 14 | 0 |
| 1999 | 8 | 0 |
| 2000 | 24 | 0 |
| 2001 | 17 | 8 |
| 2002 | 18 | 23 |
| 2003 | 26 | 40 |
| 2004 | 26 | 44 |
| 2005 | 26 | 53 |
| 2006 | 38 | 53 |
| 2007 | 29 | 43 |
| 2008 | 30 | 46 |
| 2009 | 29 | 24 |
| 2010 | 44 | 27 |
| 2011 | 48 | 33 |
| 2012 | 29 | 30 |
| 2013 | 34 | 38 |
| 2014 | 29 | 30 |
| 2015 | 36 | 24 |
| 2016 | 31 | 38 |
| 2017 | 37 | 41 |
| 2018 | 37 | 57 |
| 2019 | 43 | 58 |
| 2020 | 58 | 81 |
| 2021 | 64 | 68 |
| 2022 | 61 | 86 |
| 2023 | 36 | 89 |
| 2024 | 57 | 65 |
| 2025 | 62 | 52 |
| 2026 | 34 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Light emitting assembly with raised adhesive layer6 Oct 2026US 12,757,789 B2Xiamen San'an Optoelectronics Co., Ltd.
- Transistor structure and methods of forming the same21 Jul 2026US 12,690,398 B2Massachusetts Institute of Technology
- Apparatus for fabricating display panel and fabricating method thereof23 Jun 2026US 12,666,922 B2Samsung Display Co., Ltd.
- Display device23 Jun 2026US 12,667,008 B2LG Display Co., Ltd.
- Bonding method, substrate bonding device, and substrate bonding system16 Jun 2026US 12,660,566 B2Bondtech Co., Ltd.
- Display device24 Sep 2026US 2026/0293774 A1LG Display Co., Ltd.
- Micro-transfer printing from adhesive surfaces27 Aug 2026US 2026/0249606 A1X-Celeprint Limited
- Carrier for laser die transfer, wafer assembly, and pick and place apparatus comprising the same6 Aug 2026US 2026/0231730 A1Nexperia B. V.
- Nanofabrication and design techniques for 3d ics and configurable asics30 Jul 2026US 2026/0220344 A1Board of Regents, The University of Texas System
- Transfer method for transferring electronic components and electronic arrangement30 Jul 2026US 2026/0223503 A1ams-OSRAM International GmbH
Most cited
By later US patents
- Process for the production of thin semiconductor material films1,233US 5,374,564 ACommissariat A L' Energie Atomique · 1994
- Separating method, method for transferring thin film device, thin film device, thin film integrated circuit device, and liquid crystal display device manufactured by using the transferring method924US 6,372,608 B1Seiko Epson Corporation · 2002
- Separation of thin films from transparent substrates by selective optical processing783US 6,071,795 AThe Regents of the University of California · 2000
- Package of integrated circuits and vertical integration749US 6,322,903 B1Tru-Si Technologies, Inc. · 2001
- Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same714US 6,645,830 B2Seiko Epson Corporation · 2003