Bonding method, substrate bonding device, and substrate bonding system
AssigneeBondtech Co., Ltd.
InventorAkira Yamauchi
Life of this patent
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Abstract
A bonding method includes a substrate holding step of holding substrates (W1, W2), a first contact step of bringing central portions of the substrates (W1, W2) into contact with each other, a second contact step of, enlarging a contact area between the substrates (W1, W2) from central portions toward peripheral portions of the substrates (W1, W2), and a bonding step of, bonding the substrates (W1, W2) to each other by pressing only a peripheral portion of the substrate (W1) against a peripheral portion of the substrate (W2) while the substrates (W1, W2) are in contact with each other over entire bonding surfaces.
Claims23
A bonding method for bonding a first substrate and a second substrate to each other, the bonding method comprising:
- a substrate holding step of holding the first substrate and the second substrate while only a peripheral portion is held with respect to at least one of the first substrate and the second substrate and a bonding surface of the first substrate and a bonding surface of the second substrate face each other,
- a first contact step of bringing a central portion of the first substrate and a central portion of the second substrate into contact with each other while bending the first substrate in such a manner that a central portion of the first substrate protrudes toward the second substrate with respect to a peripheral portion of the first substrate;
- a second contact step of, after the first contact step, enlarging a contact area between the first substrate and the second substrate from central portions toward peripheral portions of the first substrate and the second substrate;
- and
- a bonding step of, after the second contact step, bonding the first substrate and the second substrate to each other by pressing only an entire peripheral portion of the first substrate against an entire peripheral portion of the second substrate to press the entire peripheral portion of the first substrate and the entire peripheral portion of the second substrate against each other in a direction in which the entire peripheral portion of the first substrate and the entire peripheral portion of the second substrate come close to each other while (i) a peripheral portion of the first substrate is held by a first substrate holder in which a recessed portion is formed in a second area on an inner side of a first area that faces the peripheral portion of the first substrate while the first substrate holder holds the first substrate and (ii) the first substrate and the second substrate are in contact with each other over entire bonding surfaces.
A substrate bonding device for bonding a first substrate and a second substrate to each other, the substrate bonding device comprising:
- a first substrate holder to hold a peripheral portion of the first substrate in which a recessed portion is formed in a second area on an inner side of a first area that faces a peripheral portion of the first substrate while the first substrate holder holds the first substrate;
- a second substrate holder to hold the second substrate while a bonding surface of the second substrate is caused to face a bonding surface of the first substrate;
- a holder driver to drive at least one of the first substrate holder and the second substrate holder in a direction in which the first substrate holder and the second substrate holder come close to or separate from each other;
- and
- a controller to control the holder driver to enlarge a contact area between the first substrate and the second substrate from central portions toward peripheral portions of the first substrate and the second substrate from a state in which the first substrate is held by the first substrate holder while the first substrate is bent in such a manner that a central portion of the first substrate protrudes toward the second substrate with respect to a peripheral portion of the first substrate and a central portion of the first substrate and a central portion of the second substrate are in contact with each other and press only an entire peripheral portion of the first substrate against an entire a peripheral portion of the second substrate to press the entire peripheral portion of the first substrate and the entire peripheral portion of the second substrate against each other in a direction in which the entire peripheral portion of the first substrate and the entire peripheral portion of the second substrate come close to each other by pressing the first substrate holder against the second substrate holder while the first substrate and the second substrate are brought into contact with each other over the entire bonding surfaces.
Dependencies are inferred from the claim text.