Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device and liquid crystal display device produced by the same
AssigneeSeiko Epson Corporation
InventorsTatsuya Shimoda, Satoshi Inoue, Wakao Miyazawa
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Abstract
A method for transferring a thin film device on a substrate onto a transfer member, includes a step for forming a separation layer on the substrate, a step for forming a transferred layer including the thin film device on the separation layer, a step for adhering the transferred layer including the thin film device to the transfer member with an adhesive layer therebetween, a step for irradiating the separation layer with light so as to form internal and/or interfacial exfoliation of the separation layer, and a step for detaching the substrate from the separation layer.
Claims15
A transferring method, comprising:
- forming a separation layer over the substrate;
- forming an interlayer over the separation layer;
- forming a transferred layer on the interlayer;
- joining a transfer member to the transferred layer;
- and
- causing exfoliation at at least one of the separation layer and an interface between the separation layer and the substrate, the transferred layer being transferred to the transfer member.
A method for manufacturing an active matrix substrate, comprising:
- forming a separation layer over the substrate;
- forming an interlayer over the separation layer;
- forming a transferred layer including a plurality of thin film transistors on the interlayer;
- joining a transfer member, which is supposed to be the active matrix substrate, to the a transferred layer;
- and
- causing exfoliation at at least one of the separation layer and an interface between the separation layer and the substrate, such that the thin film transistors are transferred to the transfer member.
Dependencies are inferred from the claim text.